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THS6043ID Datasheet(PDF) 2 Page - Texas Instruments |
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THS6043ID Datasheet(HTML) 2 Page - Texas Instruments |
2 / 46 page THS6042, THS6043 350 mA, ±12 V ADSL CPE LINE DRIVERS SLOS264G − MARCH 2000 − REVISED DECEMBER 2001 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 AVAILABLE OPTIONS PACKAGED DEVICE EVALUATION TA SOIC-8 (D) SOIC-8 PowerPAD (DDA) SOIC-14 (D) TSSOP-14 (PWP) EVALUATION MODULES 0 °C to 70°C THS6042CD THS6042CDDA THS6043CD THS6043CPWP THS6042EVM THS6043EVM −40 °C to 85°C THS6042ID THS6042IDDA THS6043ID THS6043IPWP — absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage, VCC+ to VCC− 33 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input voltage ± VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output current (see Note 1) 450 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Differential input voltage ± 4 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Maximum junction temperature 150 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Total power dissipation at (or below) 25 °C free-air temperature See Dissipation Ratings Table . . . . . . . . . . . Operating free-air temperature, TA: Commercial 0 °C to 70°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Industrial −40 °C to 85°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature, Tstg : Commercial −65 °C to 125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Industrial −65 °C to 125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The THS6042 and THS6043 may incorporate a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD thermally enhanced package. DISSIPATION RATING TABLE PACKAGE θJA θJC TA = 25°C TJ = 150°C POWER RATING D-8 95 °C/W‡ 38.3 °C/W‡ 1.32 W DDA 45.8 °C/W‡ 9.2 °C/W‡ 2.73 W D-14 66.6 °C/W‡ 26.9 °C/W‡ 1.88 W PWP 37.5 °C/W 1.4 °C/W 3.3 W ‡ This data was taken using the JEDEC proposed high-K test PCB. For the JEDEC low-K test PCB, the ΘJA is168°C/W for the D−8 package and 122.3°C/W for the D−14 package. |
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