Supertex inc.

Supertex inc.

www.supertex.com

DN3135

Doc.# DSFP-DN3135

C060413

Features

Applications

General Description

The Supertex DN3135 is a low threshold depletion-mode

(normally-on) transistor utilizing an advanced vertical

DMOS structure and Supertex’s well-proven silicon-gate

manufacturing process. This combination produces a device

with the power handling capabilities of bipolar transistors

and with the high input impedance and positive temperature

coefficient inherent in MOS devices. Characteristic of all

MOS structures, this device is free from thermal runaway and

thermally-induced secondary breakdown.

Supertex’s vertical DMOS FETs are ideally suited to a

wide range of switching and amplifying applications where

high breakdown voltage, high input impedance, low input

capacitance, and fast switching speeds are desired.

Absolute Maximum Ratings

Parameter

Value

Drain-to-source voltage

BV

DSX

Drain-to-gate voltage

BV

DGX

Gate-to-source voltage

±20V

Operating and storage

temperature

Absolute Maximum Ratings are those values beyond which damage to the device

may occur. Functional operation under these conditions is not implied. Continuous

operation of the device at the absolute rating level may affect device reliability. All

voltages are referenced to device ground.

N-Channel Depletion-Mode

Vertical DMOS FETs

Product Marking

DRAIN

SOURCE

GATE

GATE

SOURCE

DRAIN

DRAIN

TO-236AB (SOT-23)

TO-243AA (SOT-89)

TO-236AB (SOT-23)

TO-243AA (SOT-89)

= “Green” Packaging

= “Green” Packaging

Pin Configuration

Package may or may not include the following marks: Si or

Package may or may not include the following marks: Si or

Ordering Information

Part Number

Package Option

Packing

DN3135K1-G

TO-236AB (SOT-23)

3000/Reel

DN3135N8-G

TO-243AA (SOT-89)

2000/Reel

Product Summary

BV

R

DS(ON)

(max)

I

DSS

(min)

350V

35Ω

180mA

Package

θ

ja

TO-236AB (SOT-23)

TO-243AA (SOT-89)

Typical Thermal Resistance

-G denotes a lead (Pb)-free / RoHS compliant package.

Contact factory for Wafer / Die availablity.

Devices in Wafer / Die form are lead (Pb)-free / RoHS compliant.