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THS6132RGWR Datasheet(PDF) 2 Page - Texas Instruments |
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THS6132RGWR Datasheet(HTML) 2 Page - Texas Instruments |
2 / 26 page THS6132 SLLS543A − SEPTEMBER 2002 − REVISED FEBRUARY 2003 www.ti.com 2 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage. ORDERING INFORMATION PRODUCT PACKAGE PACKAGE SYMBOL TA ORDER NUMBER TRANSPORT PRODUCT PACKAGE PACKAGE CODE SYMBOL TA ORDER NUMBER TRANSPORT MEDIA THS6132VFP TQFP-32 PowerPAD VFP−32 THS6132 THS6132VFP Tube THS6132VFP TQFP-32 PowerPAD VFP−32 THS6132 −40 °C to 85°C THS6132VFPR Tape and reel THS6132RGW Leadless 25-pin 5,mm x 5, mm PowerPAD RGW−25 6132 −40 °C to 85°C THS6132RGWR Tape and reel PACKAGE DISSIPATION RATINGS PACKAGE ΘJA ΘJC TA ≤ 25°C POWER RATING(1) TA = 70°C POWER RATING(1) TA = 85°C POWER RATING(1) VFP−32 29.4 °C/W 0.96 °C/W 3.57 W 2.04 W 1.53 W RGW−25 31 °C/W 1.7 °C/W 3.39 W 1.94 W 1.45 W (1) Power rating is determined with a junction temperature of 130°C. This is the point where distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or below 125 _C for best performance. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) THS6132 Supply voltage, VCC(H) and VCC(L) (2) ±16.5 V Input voltage, VI ±VCC(L) Output current, IO (3) 900 mA Differential input voltage, VIO ±2 V Maximum junction temperature, TJ (see Dissipation Rating Table for more information) 150 °C Operating free−air temperature, TA −40 °C to 85°C Storage temperature, TStg 65 °C to 150°C Lead temperature, 1,6 mm (1/16−inch) from case for 10 seconds 300 °C HBM 1 kV ESD ratings CDM 500 V ESD ratings MM 200 V (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) VCC(H) must always be greater than or equal to VCC(L) for proper operation. Class-AB mode operation occurs when VCC(H) is equal to VCC(L) and is considered acceptable operation for the THS6132 even though it is not fully specified in this mode of operation. (3) The THS6132 incorporates a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature that could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD thermally enhanced package. PowerPAD is a trademark of Texas Instruments. |
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