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TLC5927-Q1 Datasheet(PDF) 3 Page - Texas Instruments

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Part # TLC5927-Q1
Description  TLC592x-Q1 16-Channel Constant-Current LED Sink Drivers
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TLC5927-Q1 Datasheet(HTML) 3 Page - Texas Instruments

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24
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22
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19
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17
16
15
14
13
GND
SDI
CLK
LE(ED1)
OUT0
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
VDD
R-EXT
SDO
OE(ED2)
OUT15
OUT14
OUT13
OUT12
OUT11
OUT10
OUT9
OUT8
TLC5926-Q1, TLC5927-Q1
www.ti.com
SLVS973A – SEPTEMBER 2009 – REVISED JULY 2015
5 Device Comparison Table
OPEN-LOAD
SHORT TO GND
SHORT TO VLED
DEVICE(1)
DETECTION
DETECTION
DETECTION
TLC5926-Q1
x
x
TLC5927-Q1
x
x
x
(1)
The device has one single error register for all these conditions (one error bit per channel)
6 Pin Configuration and Functions
PWP Package
24-Pin HTSSOP With PowerPAD™
Top View
NOTE: The exposed thermal pad should be connected to ground in all applications.
Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO.
CLK
3
I
Clock input for data shift on rising edge
GND
1
Ground for control logic and current sink
Data strobe input
Serial data is transferred to the respective latch when LE(ED1) is high. The data is latched when
LE(ED1)
4
I
LE(ED1) goes low. Also, a control signal input for an Error Detection mode and Current Adjust mode
(See Timing Diagram). LE(ED1) has an internal pulldown.
Output enable. When OE (ED2)(active) is low, the output drivers are enabled; when OE(ED2) is high, all
OE(ED2)
21
I
output drivers are turned OFF (blanked). Also, a control signal input for an Error Detection mode and
Current Adjust mode (See Device Functional Modes). OE(ED2) has an internal pullup.
15, 16,
OUT0–OUT
17, 18,
O
Constant-current output
15
19, 20
R-EXT
23
I
Input pin used to connect an external resistor for setting up all output currents
SDI
2
I
Serial-data input to the Shift register
SDO
22
O
Serial-data output to the following SDI of next driver IC or to the microcontroller
VDD
24
I
Supply voltage
Exposed
Connect to GND. The thermal pad should be soldered to ground in all applications.
Thermal PAD(1)
(1)
The exposed Thermal PAD should be connected to ground in all applications.
Copyright © 2009–2015, Texas Instruments Incorporated
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