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TLC5945PWPG4 Datasheet(PDF) 2 Page - Texas Instruments |
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TLC5945PWPG4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 30 page www.ti.com ABSOLUTE MAXIMUM RATINGS. TLC5945 SLVS755 – MARCH 2007 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION TA PACKAGE(1) PART NUMBER –40 °C to 85°C 28-pin HTSSOP PowerPAD™ TLC5945PWP –40 °C to 85°C 32-pin 5 mm x 5 mm QFN TLC5945RHB (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. over operating free-air temperature range (unless otherwise noted)(1) UNIT VI Input voltage range(2) VCC –0.3 V to 6 V IO Output current (dc) 90 mA VI Input voltage range V(BLANK), V(SCLK), V(XLAT), V(MODE), V(SIN), V(GSCLK), V(IREF), V(TEST) –0.3 V to VCC +0.3 V V(SOUT), V(XERR) –0.3 V to VCC +0.3 V VO Output voltage range V(OUT0) to V(OUT15) –0.3 V to 18 V HBM (JEDEC JESD22-A114, Human Body Model) 2 kV ESD rating CDM (JEDEC JESD22-C101, Charged Device Model) 500 V Tstg Storage temperature range –55 °C to 150°C TA Operating ambient temperature range –40 °C to 85°C HTSSOP (PWP)(4) 31.58 °C/W Package thermal impedance(3) QFN (RHB)(4) 35.9 °C/W (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. (3) The package thermal impedance is calculated in accordance with JESD 51-7. (4) With PowerPAD soldered on PCB with 2-oz. trace of copper. See TI application report SLMA002 for further information. 2 Submit Documentation Feedback |
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