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TLE2227CP Datasheet(PDF) 2 Page - Texas Instruments |
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TLE2227CP Datasheet(HTML) 2 Page - Texas Instruments |
2 / 32 page TLE2227, TLE2227Y, TLE2237, TLE2237Y EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION DUAL OPERATIONAL AMPLIFIERS SLOS184 – FEBRUARY 1997 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 symbol (each amplifier) + – OUT IN + IN – TLE2227Y chip information This chip, properly assembled, displays characteristics similar to the TLE2227C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips my be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. + – 1OUT 1IN + 1IN – VCC+ (8) (6) (3) (2) (5) (1) – + (7) 2IN + 2IN – 2OUT (4) VCC– 116 104 (1) (2) (3) (4) (5) (6) (7) (8) |
Similar Part No. - TLE2227CP |
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