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TLV2313IDGKR Datasheet(PDF) 6 Page - Texas Instruments |
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TLV2313IDGKR Datasheet(HTML) 6 Page - Texas Instruments |
6 / 39 page 6 TLV313, TLV2313, TLV4313 SBOS753A – JUNE 2016 – REVISED JUNE 2016 www.ti.com Product Folder Links: TLV313 TLV2313 TLV4313 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Input pins are diode-clamped to the power-supply rails. Input signals that may swing more than 0.5 V beyond the supply rails must be current limited to 10 mA or less. (3) Short-circuit to ground, one amplifier per package. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Voltage Supply voltage 7 V Signal input terminals(2) (V −) − (0.5) (V+) + 0.5 V Current Signal input terminals(2) –10 10 mA Output short circuit(3) Continuous Temperature Operating, TA –40 150 °C Junction, TJ 150 °C Storage, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±1000 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VS Supply voltage 1.8 5.5 V TA Specified temperature range –40 125 °C |
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