Electronic Components Datasheet Search |
|
TLV2334IPWR Datasheet(PDF) 2 Page - Texas Instruments |
|
TLV2334IPWR Datasheet(HTML) 2 Page - Texas Instruments |
2 / 33 page TLV2332, TLV2332Y, TLV2334, TLV2334Y LinCMOS ™ LOW-VOLTAGE MEDIUM-POWER OPERATIONAL AMPLIFIERS SLOS189 – FEBRUARY 1997 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 description (continued) These amplifiers offer a level of ac performance greater than that of many other devices operating at comparable power levels. The TLV233x operational amplifiers are especially well suited for use in low-current or battery-powered applications. Low-voltage and low-power operation has been made possible by using the Texas Instruments silicon-gate LinCMOS ™ technology. The LinCMOS process also features extremely high input impedance and ultra-low bias currents making these amplifiers ideal for interfacing to high-impedance sources such as sensor circuits or filter applications. To facilitate the design of small portable equipment, the TLV233x is made available in a wide range of package options, including the small-outline and thin-shrink small-outline package (TSSOP). The TSSOP package has significantly reduced dimensions compared to a standard surface-mount package. Its maximum height of only 1.1 mm makes it particularly attractive when space is critical. The device inputs and outputs are designed to withstand –100-mA currents without sustaining latch-up. The TLV233x incorporates internal ESD-protection circuits that prevents functional failures at voltages up to 2000 V as tested under MIL-STD 883C, Method 3015.2; however, care should be exercised in handling these devices as exposure to ESD may result in the degradation of the device parametric performance. TLV2332Y chip information This chip, when properly assembled, display characteristics similar to the TLV2332. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (4) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + – 1OUT 1IN + 1IN – VDD VDD – / GND (8) (6) (3) (2) (5) (1) – + (7) 2IN + 2IN – 2OUT (4) 59 72 (1) (2) (3) (4) (5) (6) (7) (8) |
Similar Part No. - TLV2334IPWR |
|
Similar Description - TLV2334IPWR |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |