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TLV2362ID Datasheet(PDF) 1 Page - Texas Instruments |
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TLV2362ID Datasheet(HTML) 1 Page - Texas Instruments |
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1 / 23 page  TLV2361, TLV2362 HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS SLOS195H − FEBRUARY 1997 − REVISED JUNE 2007 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443 D Low Supply-Voltage Operation...VCC = ±1 V Min D Wide Bandwidth ...7 MHz Typ at VCC± = ±2.5 V D High Slew Rate ...3 V/µs Typ at VCC± = ±2.5 V D Wide Output Voltage Swing . . . ±2.4 V Typ at VCC± = ±2.5 V, RL = 10 kΩ D Low Noise ...8 nV/√Hz Typ at f = 1 kHz description/ordering information The TLV236x devices are high-performance dual operational amplifiers built using an original Texas Instruments bipolar process. These devices can be operated at a very low supply voltage ( ±1 V), while maintaining a wide output swing. The TLV236x devices offer a dramatically improved dynamic range of signal conditioning in low-voltage systems. The TLV236x devices also provide higher performance than other general-purpose operational amplifiers by combining higher unity-gain bandwidth and faster slew rate. With their low distortion and low-noise performance, these devices are well suited for audio applications. ORDERING INFORMATION TA PACKAGE† ORDERABLE PART NUMBER TOP-SIDE MARKING‡ 0 °Cto70°C SOT 23 5 (DBV) Reel of 3000 TLV2361CDBVR YC3 −0 °C to 70°C SOT-23-5 (DBV) Reel of 250 TLV2361CDBVT YC3_ SOT 23 5 (DBV) Reel of 3000 TLV2361IDBVR YC4 SOT-23-5 (DBV) Reel of 250 TLV2361IDBVT YC4_ MSOP/VSSOP (DGK) Reel of 2500 TLV2362IDGKR YBS PDIP (P) Tube of 50 TLV2362IP TLV2362IP −40 °C to 85°C SOIC (D) Tube of 75 TLV2362ID 2362I 40 C to 85 C SOIC (D) Reel of 2500 TLV2362IDR 2362I SOP (PS) Reel of 2000 TLV2362IPSR TY2362 TSSOP (PW) Tube of 150 TLV2362IPW TY2362 TSSOP (PW) Reel of 2000 TLV2362IPWR TY2362 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. ‡ DBV: The actual top-side marking has one additional character that designates the wafer fab/assembly site. Copyright 2007, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 1 2 3 4 8 7 6 5 1OUT 1IN− 1IN+ VCC− VCC+ 2OUT 2IN− 2IN+ TLV2361 . . . DBV PACKAGE (TOP VIEW) TLV2362 . . . D, DGK, P, PS, OR PW PACKAGE (TOP VIEW) 1 2 3 5 4 IN+ VCC− IN− VCC+ OUT |
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