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TLK1201ARCPR Datasheet(PDF) 10 Page - Texas Instruments |
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TLK1201ARCPR Datasheet(HTML) 10 Page - Texas Instruments |
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10 / 24 page  www.ti.com ABSOLUTE MAXIMUM RATINGS (1) DISSIPATION RATING TABLE TLK1201ARCP, TLK1201AIRCP ETHERNET TRANSCEIVERS SLLS580D – FEBRUARY 2004 – REVISED SEPTEMBER 2007 over operating free-air temperature range (unless otherwise noted) TLK1201A/TLK1201AI Supply voltage, VDD (see (2)) –0.3 V to 3 V Input voltage range at TTL terminals, VI –0.5 V to 4 V Input voltage range at any other terminal –0.3 V to VDD +0.3 V Storage temperature, Tstg –65 °C to 150°C Electrostatic discharge CDM: 1 kV, HBM:2 kV TLK1201A 0 °C to 70°C Characterized free-air operating temperature range TLK1201AI –40 °C to 85°C (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal. TA ≤ 25°C OPERATING FACTOR(1) TA = 70°C PACKAGE POWER RATING ABOVE TA = 25°C POWER RATING RCP64(2) 5.25 W 46.58 mW/ °C 2.89 W RCP64(3) 3.17 W 23.70 mW/ °C 1.74 W RCP64(4) 2.01 W 13.19 mW/ °C 1.11 W (1) This is the inverse of the traditional junction-to-ambient thermal resistance (RΘJA). (2) 2 oz. Trace and copper pad with solder (3) 2 oz. Trace and copper pad without solder (4) Standard JEDEC high-K board Thermal Characteristics PARAMETER TEST CONDITION MIN TYP MAX UNIT Board-mounted, no air flow, high conductivity TI recommended test board, chip soldered or greased to 21.47 thermal land Junction-to-free-air thermal RΘJA Board-mounted, no air flow, high conductivity TI °C/W resistance recommended test board with thermal land but no solder or 42.2 grease thermal connection to thermal land Board-mounted, no air flow, JEDEC test board 75.83 Board-mounted, no air flow, high conductivity TI recommended test board, chip soldered or greased to 0.38 thermal land Junction-to-case-thermal RΘJC Board-mounted, no air flow, high conductivity TI °C/W resistance recommended test board with thermal land but no solder or 0.38 grease thermal connection to thermal land Board-mounted, no air flow, JEDEC test board 7.8 10 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Link(s): TLK1201ARCP TLK1201AIRCP |
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