TLV277xEP, TLV277xAEP

FAMILY OF 2.7V HIGHSLEW RATE RAILTORAIL OUTPUT

OPERATIONAL AMPLIFIERS WITH SHUTDOWN

SGLS317A − OCTOBER 2005 − REVISED SEPTEMBER 2007

1

POST OFFICE BOX 655303

− One Assembly/Test Site, One Fabrication

Site

−55

°C to 125°C

Sources (DMS) Support

MIL-STD-883, Method 3015; Exceeds 200 V

Using Machine Model (C = 200 pF, R = 0)

0.005% THD+N

† Component qualification in accordance with JEDEC and industry

standards to ensure reliable operation over an extended

temperature range. This includes, but is not limited to, Highly

Accelerated Stress Test (HAST) or biased 85/85, temperature

cycle, autoclave or unbiased HAST, electromigration, bond

intermetallic life, and mold compound life. Such qualification

testing should not be viewed as justifying use of this component

beyond specified performance and environmental limits.

description

The TLV277x CMOS operational amplifier family combines high slew rate and bandwidth, rail-to-rail output

swing, high output drive, and excellent dc precision. The device provides 10.5 V/

µs of slew rate and 5.1 MHz

of bandwidth while only consuming 1 mA of supply current per channel. This ac performance is much higher

than current competitive CMOS amplifiers. The rail-to-rail output swing and high output drive make these

devices a good choice for driving the analog input or reference of analog-to-digital converters (ADCs) . These

devices also have low distortion while driving a 600-

Ω load for use in telecom systems.

These amplifiers have a 360-

µV input offset voltage, a 17 nV/√Hz input noise voltage, and a 2-pA input bias

current for measurement, medical, and industrial applications. The TLV277x family is also specified across an

extended temperature range (−55

°C to 125°C), making it useful for military and avionics systems.

These devices operate from a 2.5-V to 5.5-V single supply voltage and are characterized at 2.7 V and 5 V. The

single-supply operation and low power consumption make these devices a good solution for portable

applications. The following table lists the packages available.

FAMILY PACKAGE TABLE

DEVICE

NUMBER

OF

PACKAGE

TYPES

SHUTDOWN

UNIVERSAL

EVM BOARD

DEVICE

OF

CHANNELS

SOIC

TSSOP

SHUTDOWN

EVM BOARD

TLV2770

1

8

—

Yes

TLV2771

1

8

—

—

See the EVM

TLV2772

2

8

8

—

See the EVM

Selection Guide

TLV2773

2

14

—

Yes

Selection Guide

(SLOU060)

TLV2774

4

14

14

—

(SLOU060)

TLV2775

4

16

16

Yes

Copyright

 2007 Texas Instruments Incorporated

UNLESS OTHERWISE NOTED this document contains PRODUCTION

DATA information current as of publication date. Products conform to

specifications per the terms of Texas Instruments standard warranty.

Production processing does not necessarily include testing of all

parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.