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TLV70012DDCR Datasheet(PDF) 5 Page - Texas Instruments |
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TLV70012DDCR Datasheet(HTML) 5 Page - Texas Instruments |
5 / 36 page TLV700 www.ti.com SLVSA00E – SEPTEMBER 2009 – REVISED APRIL 2015 6 Specifications 6.1 Absolute Maximum Ratings over operating junction temperature range (unless otherwise noted) (1) MIN MAX UNIT VIN –0.3 6 Voltage VEN –0.3 6(2) V VOUT –0.3 6 Maximum output current IOUT Internally limited Output short-circuit duration Indefinite Operating junction, TJ –55 150 Temperature °C Storage, Tstg –55 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) VEN absolute maximum rating is VIN + 0.3 V or 6 V, whichever is less. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101, ±500 all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN 2 5.5 V VOUT 1.2 4.8 V IOUT 0 200 mA 6.4 Thermal Information TLV700 THERMAL METRIC(1) DCK [SC70] DDC [SOT] DSE [WSON] UNIT 5 PINS 5 PINS 6 PINS RθJA Junction-to-ambient thermal resistance 307.6 235.9 321.3 RθJC(top) Junction-to-case (top) thermal resistance 79.1 61.9 207.9 RθJB Junction-to-board thermal resistance 93.7 54 281.5 °C/W ψJT Junction-to-top characterization parameter 1.3 0.8 42.4 ψJB Junction-to-board characterization parameter 92.8 53.4 284.8 RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a 142.3 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2009–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TLV700 |
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