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TLV2765IDG4 Datasheet(PDF) 2 Page - Texas Instruments |
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TLV2765IDG4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 46 page TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765 FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN SLOS326F − JUNE 2000 − REVISED AUGUST 2013 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLV2760 and TLV2761 AVAILABLE OPTIONS(1) PACKAGED DEVICES TA VIOmax AT 25°C SMALL OUTLINE SOT-23 PLASTIC DIP TA AT 25°C SMALL OUTLINE (D)† (DBV)‡ SYMBOL PLASTIC DIP (P) 0°C to 70°C 3500 μV TLV2760CD TLV2761CD — — — — — — −40°C to 85°C 3500 μV TLV2760ID TLV2761ID TLV2760IDBV TLV2761IDBV VANI VAXI TLV2760IP TLV2761IP † This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2760CDR). ‡ This package is only available taped and reeled. For standard quantities (3,000 pieces per reel), add an R suffix (i.e., TLV2760CDBVR). For smaller quantities (250 pieces per mini-reel), add a T suffix to the part number (e.g. TLV2760CDBVT). TLV2762 and TLV2763 AVAILABLE OPTIONS(1) PACKAGED DEVICES TA VIOmax AT 25°C SMALL OUTLINE MSOP PLASTIC DIP PLASTIC DIP TA AT 25°C OUTLINE (D)† DGK† SYMBOL DGS† SYMBOL DIP (N) DIP (P) 0°C to 70°C 3500 μV TLV2762CD TLV2763CD — TLV2762CDGK — AJO — — — — — — — — −40°C to 85°C 3500 μV TLV2762ID TLV2763ID TLV2762IDGK — xxTIAJP — — TLV2763IDGS — xxTIAJR — TLV2763IN TLV2762IP — † This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2762CDR). TLV2764 and TLV2765 AVAILABLE OPTIONS(1) V ma PACKAGED DEVICES TA VIOmax AT 25°C SMALL OUTLINE (D)† PLASTIC DIP (N) TSSOP (PW)† 0°C to 70°C 3500 μV TLV2764CD TLV2765CD — — — — −40°C to 85°C 3500 μV TLV2764ID TLV2765ID TLV2764IN TLV2765IN TLV2764IPW TLV2765IPW † This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2764CDR). 1. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. |
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