UCC2540

SLUS539C − JUNE 2004 − REVISED OCTOBER 2008

3

www.ti.com

ORDERING INFORMATION

TA = TJ

HTSSOP−20 (PWP)(1)

TA = TJ

Bulk

−40

°C to +105°C

UCC2540PWP

(1) The PWP package is also available at 70 devices per tube and taped and reeled at

2,000 devices per reel. Add an R suffix to the device type (i.e., UCC2540PWPR). See

the application section of the data sheet for PowerPAD drawing and layout information.

CONNECTION DIAGRAM

1

2

3

4

5

6

7

8

9

10

20

19

18

17

16

15

14

13

12

11

RSET

REF

G2C

SYNCIN

RAMP

GND

VEA−

CEA−

COMP

TR

SWS

BST

G1

SW

VDD

PGND

G2

VDRV

G2S

SS

PWP PACKAGE

(TOP VIEW)

NOTE: The PowerPAD

t is not directly connected to any lead of the package. It is electrically and thermally connected to the substrate of the

device which acts as ground and should be connected to PGND on the PCB. The exposed dimension is 1.3 mm x 1.7 mm. However, the

tolerances can be +1.05 mm / −0.05 mm (+41 mils / −2 mils) due to position and mold flow variation.

THERMAL INFORMATION

PACKAGE

FAMILY

PACKAGE

DESIGNATOR

θJA (°C/W)

(with PowerPAD)

θJC (°C/W)

(without PowerPAD)

θJC (°C/W)

(with PowerPAD)

MAXIMUM DIE

TEMPERATURE

PowerPAD



HTSSOP−20

PWP

22.3 to 32.6

(500 to 0 LFM)

19.9

1.4

125

°C