UCC5606

SLUS347A – MAY 1995 – REVISED APRIL 2003

3

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CONNECTION DIAGRAM

DIL–16 (Top View)

N Package

SOIC–16 (Top View)

DP Package

TSSOP–24 (Top View)

PWP Package

NOTE: GND* serves as a heat sink ground which must be tied to a large copper area or the grounding plate.

ELECTRICAL CHARACTERISTICS

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNITS

Supply Current Section

Termpwr supply current

All termination lines = open

1

2

mA

Termpwr supply current

All termination lines = 0.2 V

210

218

mA

Power down mode

DISCNCT = 0 V

0.5

5.0

µA

Output Section (110 ohms – Terminator Lines)

Terminator impedance

102.3

110.0

117.7

Ohms

Output high voltage

TRMPWR = 3 V (1)

2.5

2.7

3.0

V

VLINE = 0.2 V,

TJ = 25°C

–22.1

–23.0

–24.0

VLINE = 0.2 V

–21

–23

–24

Max output current

VLINE = 0.2 V,

TRMPWR = 3 V,

TJ = 25°C (1)

–20.2

–23.0

–24.0

mA

VLINE = 0.2 V,

TRMPWR = 3 V (1)

–19

–23

–24

VLINE = 0.5 V

–22.4

Output leakage

DISCNCT = 0 V,

TRMPWR = 0 V to 5.25 V

10

400

nA

Output capacitance

DISCNCT = 0 V,

DP package (2)

1.8

2.5

pF

Output Section (2.5 k

Ω – Terminator Lines) (RDISCNCT = 80 kΩ)

Terminator impedance

2.0

2.5

3.0

k

Ω

Output high voltage

TRMPWR = 3 V (1)

2.5

2.7

3.0

V

Max output current

VLINE = 0.2 V

–0.7

–1.0

–1.4

mA

Max output current

VLINE = 0.2 V,

TRMPWR = 3 V (1)

–0.6

–1.0

–1.5

mA

Output leakage

DISCNCT = 0 V,

TRMPWR = 0 to 5.25 V

10

400

nA

Output capacitance

DISCNCT = 0 V,

DP package (2)

1.8

2.5

pF