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UCC3941N-3 Datasheet(PDF) 4 Page - Texas Instruments |
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UCC3941N-3 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 20 page UCC2941-3, UCC2941-5, UCC2941-ADJ, UCC3941-3, UCC3941-5, UCC3941-ADJ 1V SYNCHRONOUS BOOST CONVERTER SLUS242B – JANUARY 1999 – REVISED JUNE 2001 4 www.ti.com detailed description (continued) needs a name (SW) The SW pin inductor is connected between this node and VIN. The VGD (gate drive supply) flyback diode is also connected to this pin. When servicing the 3.3-V supply, this pin goes low charging the inductor, then shut off, dumping the energy through the synchronous rectifier to the output. When servicing the VGD supply, the internal synchronous rectifier stays off, and the energy is diverted to VGD through the flyback diode. During discontinuous portions of the inductor current a MOSFET resistively connects VIN to SW damping excess circulating energy to eliminate undesired high frequency ringing. gate drive supply (VGD) The VGD pin is coarsely regulated around 9 V, and is primarily used for the gate drive supply for the power switches in the IC. This pin can be loaded with up to 10 mA as long as it does not present a load at voltages below 2 V. This ensures proper startup of the IC. The VGD supply can go as low as 7.5 V without interfering with the servicing of the 3.3-V output. Below 7.5 V, VGD has the highest priority, although in practice the voltage should not decay to that level if the output capacitor is sized properly. output voltage (VOUT) Main output voltage (3.3 V, 5 V, or adjustable) which has highest priority in the multiplexing scheme, as long as VGD is above the critical level of 7.5 V. Loads over 150 mA are achievable at an input voltage of 1-V. This output starts up with 1-V input at full load. absolute maximum ratings over operating free–air temperature range (unless otherwise noted)† Input voltage VIN, PLIM –0.3 V to 10 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Voltage range, VGD, SW –0.3 V to 15 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Voltage range, SD –0.3 V to VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output voltage range, VOUT –0.3 V to 10 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating virtual junction temperature range, TJ –55 _C to 150_C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, Tstg –65 _C to 150_C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds 300 _C . . . . . . . . . . . . . . . . . . . . . . . CDM 1 kV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. Currents are positive into, negative out of the specified terminal. DISSIPATION RATING TABLE PACKAGE TA ≤ 25_C POWER RATING DERATING FACTOR ABOVE TA = 25_C TA = 85_C POWER RATING D 760 mW 6.1 mW/ _C 390 mW N 980 mW 7.9 mW/ _C 510 mW recommended operating conditions MIN MAX UNIT Input voltage 0.8 5.0 V Output voltage 1.8 5.5 V Output current 0 200 mA |
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