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TMDS181 Datasheet(PDF) 6 Page - Texas Instruments |
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TMDS181 Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 59 page  6 TMDS181, TMDS181I SLASE75C – AUGUST 2015 – REVISED JULY 2016 www.ti.com Product Folder Links: TMDS181 TMDS181I Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Pin Functions(1) (continued) PIN TYPE(2) DESCRIPTION NAME NO. SDA_CTL 16 I/0 I2C data signal Note: When I2C_EN = Low Pin strapping takes priority and those functions cannot be changed by I2C VSadj 22 I TMDS-compliant voltage swing control nominal resistor to GND A1 27 I High address bit 2 for I2C programming Weak internal pull down Note: When in Pin Strapping Mode leave pin as No connect TX_TERM_CTL 36 I 3 level Transmit termination control TX_TERM_CTL = H, no transmit termination TX_TERM_CTL = L, transmit termination impedance in approximately 75 to 150 Ω TX_TERM_CTL = No Connect, automatically selects the termination impedance Data rate (DR) > 3.4 Gbps – 75 to 150 Ω differential near end termination 2 Gbps > DR < 3.4 Gbps – 150 to 300 Ω differential near end termination DR < 2 Gbps – no termination Note: If left floating will be in automatic select mode. SWAP/POL 1 I 3 level Input lane SWAP and polarity control pin SWAP/POL = H: receive lanes polarity swap (retimer mode only) SWAP/POL = L: receive lanes swap (redriver and retimer mode) SWAP/POL = No Connect: normal operation NC 18, 40 NA No connect (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential voltages, are with respect to network ground terminal. (3) Tested in accordance with JEDEC Standard 22, Test Method A114-B 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Supply voltage(3) VCC –0.3 4 V VDD –0.3 1.4 Voltage Main link input differential voltage (IN_Dx, IN_CLKx) IIN = 15mA VCC - 0.75V VCC + 0.3V V TMDS outputs ( OUT_Dx) –0.3 4 HPD_SRC, Vsadj, SDA_CTL, SCL_CTL, OE, A1, PRE_SEL, EQ_SEL/A0, I2C_EN/PIN, SIG_EN, TX_TERM_CTL, –0.3 4 HDP_SNK, SDA_SNK, SCL_SNK, SDA_SRC, SCL_SRC –0.3 6 Input Current IIN Main link input current (IN_Dx, IN_CLKx) 15 mA Continuous power dissipation See Thermal Information Tstg Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500 |
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