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TMS320F28066PFPS Datasheet(PDF) 6 Page - Texas Instruments |
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TMS320F28066PFPS Datasheet(HTML) 6 Page - Texas Instruments |
6 / 177 page 6 TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066 TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062 SPRS698F – NOVEMBER 2010 – REVISED MARCH 2016 www.ti.com Submit Documentation Feedback Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063 TMS320F28062 Revision History Copyright © 2010–2016, Texas Instruments Incorporated 2 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from July 2, 2014 to March 22, 2016 (from E Revision (July 2014) to F Revision) Page • Global: Changed "CAN 2.0B" to "ISO11898-1 (CAN 2.0B)". .................................................................. 1 • Table 3-1 (Device Comparison): Changed the number of High-resolution ePWM Channels on the 80-Pin PN/PFP packages from 6 to 8. ..................................................................................................... 7 • Table 3-1: Removed "Product status" row and associated footnote. ......................................................... 7 • Figure 4-1 (80-Pin PN and PFP Packages (Top View)): Added footnote about PowerPAD. .............................. 9 • Figure 4-2 (100-Pin PZ and PZP Packages (Top View)): Added footnote about PowerPAD. ........................... 10 • Section 4.2 (Signal Descriptions): Added "GPIO26–27" to NOTE. .......................................................... 11 • Table 4-1 (Signal Descriptions): Updated DESCRIPTION of X1, VREFHI, VREFLO, and VDDIO. ............................. 11 • Section 5.1 (Absolute Maximum Ratings): Added Input voltage, VIN (X1). ................................................. 19 • Section 5.1: Added Tstg. ........................................................................................................... 19 • Section 5.2 (ESD Ratings for TMS320F2806xU): Added section. ........................................................... 19 • Section 5.3 (ESD Ratings for TMS320F2806x, TMS320F2806xM, and TMS320F2806xF): Changed title from "Handling Ratings" to "ESD Ratings for TMS320F2806x, TMS320F2806xM, and TMS320F2806xF". ................. 19 • Section 5.3: Updated footnotes. .................................................................................................. 19 • Section 5.4 (Recommended Operating Conditions): Removed footnote that read "VDDIO and VDDA should be maintained within approximately 0.3 V of each other". ........................................................................ 20 • Section 5.6 (Power Consumption Summary): Changed section title from "Current Consumption" to "Power Consumption Summary". .......................................................................................................... 21 • Section 5.12 (Power Sequencing): Updated paragraph that reads "There is no power sequencing requirement needed ...". .......................................................................................................................... 29 • Table 5-10 (XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)): Added MAX value for tf(XCO) ........ 34 • Table 5-10: Added MAX value for tr(XCO) ......................................................................................... 34 • Table 5-15 (Flash/OTP Access Timing): Removed footnote. ................................................................. 36 • Figure 6-1 (28069 Memory Map): Added "FAST and SpinTAC Libraries" block. Changed size of Boot ROM. ........ 48 • Figure 6-2 (28068 Memory Map): Added "FAST and SpinTAC Libraries" block. Changed size of Boot ROM. ....... 49 • Figure 6-3 (28067 Memory Map): Added figure. ............................................................................... 50 • Figure 6-8 (28062 Memory Map): Added "FAST and SpinTAC Libraries" block. Changed size of Boot ROM. ........ 55 • Section 6.6.2 (Crystal Oscillator Option): Added paragraph that begins "The on-chip crystal oscillator X1 and X2 pins are 1.8-V level signals ...". ................................................................................................... 67 • Section 6.9.6.1.2 (McBSP as SPI Master or Slave Timing): Replaced "For all SPI slave modes ..." paragraphs with "For all SPI slave modes ..." table footnotes. ............................................................................ 115 • Table 6-44 (McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)): Added "For all SPI slave modes ..." footnote. ................................................................................................... 115 • Table 6-46 (McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)): Added "For all SPI slave modes ..." footnote. ................................................................................................... 116 • Table 6-48 (McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)): Added "For all SPI slave modes ..." footnote. ................................................................................................... 117 • Table 6-50 (McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)): Added "For all SPI slave modes ..." footnote. ................................................................................................... 118 • Table 6-65 (HRCAP Registers): Added reference to footnote for HCICLR and HCIFRC. .............................. 137 • Section 7 (Applications, Implementation, and Layout): Added section. .................................................... 156 • Section 8.1.1.1 (Getting Started): Updated links. ............................................................................. 159 • Figure 8-1 (Device Nomenclature): Updated list of devices. ................................................................ 160 • Section 8.2 (Documentation Support): Added the Calculating Useful Lifetimes of Embedded Processors Application Report (SPRABX4) to list of application reports. ............................................................... 161 • Section 8.2.1 (Receiving Notification of Document Updates): Added section. ............................................ 162 |
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