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TMS320F28066PFPS Datasheet(PDF) 6 Page - Texas Instruments

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Part # TMS320F28066PFPS
Description  Fast Interrupt Response and Processing
Download  177 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TMS320F28066PFPS Datasheet(HTML) 6 Page - Texas Instruments

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TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062
SPRS698F – NOVEMBER 2010 – REVISED MARCH 2016
www.ti.com
Submit Documentation Feedback
Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065
TMS320F28064 TMS320F28063 TMS320F28062
Revision History
Copyright © 2010–2016, Texas Instruments Incorporated
2
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from July 2, 2014 to March 22, 2016 (from E Revision (July 2014) to F Revision)
Page
Global: Changed "CAN 2.0B" to "ISO11898-1 (CAN 2.0B)".
.................................................................. 1
Table 3-1 (Device Comparison): Changed the number of High-resolution ePWM Channels on the 80-Pin
PN/PFP packages from 6 to 8.
..................................................................................................... 7
Table 3-1: Removed "Product status" row and associated footnote.
......................................................... 7
Figure 4-1 (80-Pin PN and PFP Packages (Top View)): Added footnote about PowerPAD.
.............................. 9
Figure 4-2 (100-Pin PZ and PZP Packages (Top View)): Added footnote about PowerPAD.
........................... 10
Section 4.2 (Signal Descriptions): Added "GPIO26–27" to NOTE.
.......................................................... 11
Table 4-1 (Signal Descriptions): Updated DESCRIPTION of X1, VREFHI, VREFLO, and VDDIO. ............................. 11
Section 5.1 (Absolute Maximum Ratings): Added Input voltage, VIN (X1). ................................................. 19
Section 5.1: Added Tstg. ........................................................................................................... 19
Section 5.2 (ESD Ratings for TMS320F2806xU): Added section.
........................................................... 19
Section 5.3 (ESD Ratings for TMS320F2806x, TMS320F2806xM, and TMS320F2806xF): Changed title from
"Handling Ratings" to "ESD Ratings for TMS320F2806x, TMS320F2806xM, and TMS320F2806xF".
................. 19
Section 5.3: Updated footnotes.
.................................................................................................. 19
Section 5.4 (Recommended Operating Conditions): Removed footnote that read "VDDIO and VDDA should be
maintained within approximately 0.3 V of each other".
........................................................................ 20
Section 5.6 (Power Consumption Summary): Changed section title from "Current Consumption" to "Power
Consumption Summary".
.......................................................................................................... 21
Section 5.12 (Power Sequencing): Updated paragraph that reads "There is no power sequencing requirement
needed ...".
.......................................................................................................................... 29
Table 5-10 (XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)): Added MAX value for tf(XCO) ........ 34
Table 5-10: Added MAX value for tr(XCO) ......................................................................................... 34
Table 5-15 (Flash/OTP Access Timing): Removed footnote.
................................................................. 36
Figure 6-1 (28069 Memory Map): Added "FAST and SpinTAC Libraries" block. Changed size of Boot ROM.
........ 48
Figure 6-2 (28068 Memory Map): Added "FAST and SpinTAC Libraries" block. Changed size of Boot ROM.
....... 49
Figure 6-3 (28067 Memory Map): Added figure.
............................................................................... 50
Figure 6-8 (28062 Memory Map): Added "FAST and SpinTAC Libraries" block. Changed size of Boot ROM.
........ 55
Section 6.6.2 (Crystal Oscillator Option): Added paragraph that begins "The on-chip crystal oscillator X1 and X2
pins are 1.8-V level signals ...".
................................................................................................... 67
Section 6.9.6.1.2 (McBSP as SPI Master or Slave Timing): Replaced "For all SPI slave modes ..." paragraphs
with "For all SPI slave modes ..." table footnotes.
............................................................................ 115
Table 6-44 (McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)): Added "For all
SPI slave modes ..." footnote.
................................................................................................... 115
Table 6-46 (McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)): Added "For all
SPI slave modes ..." footnote.
................................................................................................... 116
Table 6-48 (McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)): Added "For all
SPI slave modes ..." footnote.
................................................................................................... 117
Table 6-50 (McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)): Added "For all
SPI slave modes ..." footnote.
................................................................................................... 118
Table 6-65 (HRCAP Registers): Added reference to footnote for HCICLR and HCIFRC.
.............................. 137
Section 7 (Applications, Implementation, and Layout): Added section.
.................................................... 156
Section 8.1.1.1 (Getting Started): Updated links.
............................................................................. 159
Figure 8-1 (Device Nomenclature): Updated list of devices.
................................................................ 160
Section 8.2 (Documentation Support): Added the Calculating Useful Lifetimes of Embedded Processors
Application Report (SPRABX4) to list of application reports.
............................................................... 161
Section 8.2.1 (Receiving Notification of Document Updates): Added section.
............................................ 162


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