TMS320F28332PGFA datasheet(9/199 Pages) TI1

Part #	TMS320F28332PGFA

Description	PRODUCTION DATA information is current as of publication date

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Manufacturer	TI1 [Texas Instruments]

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9 / 199 page

TMS320F28335, TMS320F28334, TMS320F28332

TMS320F28235, TMS320F28234, TMS320F28232

www.ti.com

SPRS439M – JUNE 2007 – REVISED AUGUST 2012

6-53

Sequential Sampling Mode Timing

........................................................................................... 172

6-54

Simultaneous Sampling Mode Timing

....................................................................................... 173

6-55

McBSP Timing Requirements

................................................................................................ 175

6-56

McBSP Switching Characteristics

........................................................................................... 176

6-57

McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)

................................ 178

6-58

McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0)

............................ 178

6-59

McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)

................................ 179

6-60

McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0)

............................ 179

6-61

McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)

................................ 180

6-62

McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1)

............................ 180

6-63

McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)

................................ 181

6-64

McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1)

........................... 181

6-65

Flash Endurance for A and S Temperature Material

...................................................................... 182

6-66

Flash Endurance for Q Temperature Material

.............................................................................. 182

6-67

Flash Parameters at 150-MHz SYSCLKOUT

............................................................................... 182

6-68

Flash/OTP Access Timing

..................................................................................................... 182

6-69

Flash Data Retention Duration

................................................................................................ 182

6-70

Minimum Required Flash/OTP Wait-States at Different Frequencies

................................................... 183

9-1

Thermal Model 176-Pin PGF Results

........................................................................................ 187

9-2

Thermal Model 176-Pin PTP Results

........................................................................................ 187

9-3

Thermal Model 179-Ball ZHH Results

....................................................................................... 187

9-4

Thermal Model 176-Ball ZJZ Results

....................................................................................... 188

List of Tables

9

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