PACKAGE OPTION ADDENDUM

www.ti.com

10-Jun-2014

Addendum-Page 3

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C)

Device Marking

(4/5)

Samples

SN74F374N3

OBSOLETE

PDIP

N

20

TBD

Call TI

Call TI

0 to 70

SN74F374N3

OBSOLETE

PDIP

N

20

TBD

Call TI

Call TI

0 to 70

SN74F374NSR

ACTIVE

SO

NS

20

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

74F374

SN74F374NSR

ACTIVE

SO

NS

20

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

74F374

SNJ54F374FK

ACTIVE

LCCC

FK

20

1

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

5962-

9759001Q2A

SNJ54F

374FK

SNJ54F374FK

ACTIVE

LCCC

FK

20

1

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

5962-

9759001Q2A

SNJ54F

374FK

SNJ54F374J

ACTIVE

CDIP

J

20

1

TBD

A42

N / A for Pkg Type

-55 to 125

5962-9759001QR

A

SNJ54F374J

SNJ54F374J

ACTIVE

CDIP

J

20

1

TBD

A42

N / A for Pkg Type

-55 to 125

5962-9759001QR

A

SNJ54F374J

SNJ54F374W

ACTIVE

CFP

W

20

1

TBD

A42

N / A for Pkg Type

-55 to 125

5962-9759001QS

A

SNJ54F374W

SNJ54F374W

ACTIVE

CFP

W

20

1

TBD

A42

N / A for Pkg Type

-55 to 125

5962-9759001QS

A

SNJ54F374W

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.