Micropower Ultrasensitive 3D Hall-Effect Switch

A1266

3

Allegro MicroSystems, LLC

115 Northeast Cutoff

Worcester, Massachusetts 01615-0036 U.S.A.

1.508.853.5000; www.allegromicro.com

Thermal Characteristics

The A1266’s power consumption is extremely low. On-chip power dissipation will not be an issue under normal operating conditions.

Characteristic

Symbol

Notes

Rating

Unit

Package Thermal Resistance

each side connected by thermal vias

110

°C/W

Package LH-5, 4-layer board based on the JEDEC standard.

124

°C/W

20

40

60

80

100

120

140

160

180

0

100

200

300

400

500

600

700

800

900

1000

1100

1200

1300

1400

1500

1600

1700

1800

1900

4-Lay

er PCB,

Package

LH-5

(R

θJA

= 124ºC/W)

Temperature (ºC)

2-Layer

PCB,

Package

LH-3

(R

Maximum Power Dissipation versus Ambient Temperature