Electronic Components Datasheet Search |
|
OPA2316IDGKR Datasheet(PDF) 3 Page - Texas Instruments |
|
|
OPA2316IDGKR Datasheet(HTML) 3 Page - Texas Instruments |
3 / 48 page 1 2 3 4 14 13 12 11 OUTD - IND +IND V - OUTA - INA +INA V+ 5 6 7 10 9 8 +INC - INC OUTC +INB - INB OUTB A B D C 1 2 3 4 8 7 6 5 V+ OUTB - INB +INB OUTA - INA +INA V - V± V+ SHDN A SHDN B ±IN A ±IN B +IN B +IN A OUT A OUT B 1 2 3 4 5 6 7 8 9 10 OUTA -INA +INA V- 1 2 3 4 V+ OUTB -INB +INB 8 7 6 5 Exposed Thermal DiePad on Underside (2) 1 2 3 5 4 V+ - IN OUT V - +IN 1 2 3 4 5 10 9 8 7 6 V+ OUT B –IN B +IN B SHDN B OUT A –IN A +IN A V– SHDN A A B 1 2 3 5 4 V+ OUT +IN V - - IN 3 OPA316, OPA2316, OPA2316S, OPA4316 www.ti.com SBOS703E – APRIL 2014 – REVISED JUNE 2016 Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated 5 Pin Configuration and Functions DCK Package SC70-5 (Top View) DBV Package SOT23-5 (Top View) DRG Package(1) DFN-8 (Top View) Pitch: 0.5 mm. Connect thermal pad to V–. Pad size: 2.00 mm × 1.20 mm. D, DGK Packages SO-8, MSOP-8 (Top View) DGS Package MSOP-10 (Top View) RUG Package QFN-10 (Top View) PW Package TSSOP-14 (Top View) |
Similar Part No. - OPA2316IDGKR |
|
Similar Description - OPA2316IDGKR |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |