Thermal

Pad

1

GND

8

OC1

2

IN

7

OUT1

3

EN1

6

OUT2

4

EN2

5

OC2

3

TPS2062-Q1, TPS2065-Q1

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SLVSA01C – MAY 2011 – REVISED JUNE 2016

Product Folder Links: TPS2062-Q1 TPS2065-Q1

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5 Pin Configuration and Functions

TPS2062-Q1 DGN Package

8-Pin MSOP-PowerPAD

Top View

Pin Functions: TPS2062-Q1

PINS

TYPE

DESCRIPTION

NAME

NO.

EN1

3

I

Enable input, logic low (active low) turns on power switch IN-OUT1

EN2

4

I

Enable input, logic low (active low) turns on power switch IN-OUT2

GND

1

GND

Ground

IN

2

PWR

Supply Input voltage

OC1

8

O

Overcurrent, open-drain output, active low, IN-OUT1

OC2

5

O

Overcurrent, open-drain output, active low, IN-OUT2

OUT1

7

O

Power-switch output, IN-OUT1

OUT2

6

O

Power-switch output, IN-OUT2

Thermal

Pad

—

GND

Internally connected to GND; used to heat-sink the part to the circuit board ground plane, also

calledPowerPAD™ or exposed thermal pad. Must be connected to GND pin.