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TPS2370DR Datasheet(PDF) 2 Page - Texas Instruments |
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TPS2370DR Datasheet(HTML) 2 Page - Texas Instruments |
2 / 19 page TPS2370 SLUS537C − AUGUST 2002 − REVISED MARCH 2004 www.ti.com 2 DESCRIPTION (CONTINUED) During initial turnon of the switch (inrush mode), an external resistor is used to program the inrush current, allowing a wide range of capacitor values to be used at the load. According to IEEE 802.3af specification, inrush current of 400 mA is allowed only for 50 ms, limiting the load capacitor to approximately 180 µF. A programmable inrush current limit removes this limitation, allowing a larger capacitor to be used with a lower inrush current limit. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION TA PACKAGE(1) PART NUMBER 0 °C to 70°C Plastic TSSOP (PW) TPS2370PW 0 °C to 70°C Plastic SOIC (D) TPS2370D (1) The PW and D packages are also available taped and reeled. Add an R suffix to the device type (i.e., TPS2370PWR). ABSOLUTE MAXIMUM RATINGS Over operating free-air temperature range unless otherwise noted (2) TPS2370 UNIT ILIM 4 Input voltage range, wrt VEE CLASS 12 V Input voltage range, wrt VEE DET, RTN, EN_DC, VDD 68 V EN_DC (wrt RTN) 5 Operating junction temperature range, TJ −55 to 150 °C Storage temperature, Tstg −65 to 150 °C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300 °C (2) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT Input voltage, VI 48 57 V Operating junction temperature, TJ 0 70 °C DISSIPATION RATINGS(3)(4) PACKAGE THERMAL IMPEDANCE JUNCTION-TO-AMBIENT TA < 25°C POWER RATING TA = 25°C DERATING FACTOR TA = 70°C POWER RATING 8-Pin Plastic TSSOP (PW) 258.5 °C/W 464 mW 3.9 mW/ °C 290 mW 8-Pin Plastic SOIC (D) 176.0 °C/W 682 mW 5.7 mW/ °C 426 mW (3) Test board conditions: 1. 3” x 3”, 4 layers, thickness: 0.062” 2. 1.5 oz. copper traces located on the top of the PCB 3. 1.5 oz. copper ground plane on the bottom of the PCB 4. 0.5 oz. copper ground planes on the 2 internal layers 5. 12 thermal vias (4) Maximum power dissipation may be limited by overcurrent protection. |
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