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OPA561PWP Datasheet(PDF) 10 Page - Texas Instruments |
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OPA561PWP Datasheet(HTML) 10 Page - Texas Instruments |
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10 / 17 page  OPA561 SBOS206E − DECEMBER 2001 − REVISED FEBRUARY 2007 www.ti.com 10 THERMAL RESISTANCE vs CIRCUIT BOARD COPPER AREA 45 40 35 30 25 20 0 123 45 Copper Area (inches2) OPA561 Surface Mount Package 2oz copper Figure 5. Thermal Resistance vs Circuit Board Copper Area AMPLIFIER MOUNTING What is PowerPAD? The OPA561 uses the HTSSOP-20 PowerPAD package, a thermally enhanced, standard size IC package designed to eliminate the use of bulky heatsinks and slugs traditionally used in thermal packages. This package can be easily mounted using standard PCB assembly tech- niques, and can be removed and replaced using standard repair procedures. The PowerPAD package is designed so that the leadframe die pad (or thermal pad) is exposed on the bottom of the IC, as shown in Figure 6. This provides an extremely low thermal resistance ( qJC ) path between the die and the exterior of the package. The thermal pad on the bottom of the IC must be soldered directly to the PCB, using the PCB as a heatsink. In addition, through the use of thermal vias, the thermal pad can be directly connected to a ground plane or special heatsink structure designed into the PCB. Mold Compound (Epoxy) Leadframe Die Pad Exposed atBaseofthe Package Leadframe (Copper Alloy) IC (Silicon) Die Attach (Epoxy) Figure 6. Section View of a PowerPAD Package Soldering the PowerPAD to the PCB is always recommended, even with applications that have low power dissipation. It provides the necessary connection between the leadframe die and the PCB. The PowerPAD must be connected to the most negative supply of the device. PowerPAD Assembly Process 1. Prepare the PCB with a top side etch pattern, as shown in the attached Thermal Land Pattern mechanical drawing. There should be etch for the leads as well as etch for the thermal land. 2. Place the recommended number of holes (or thermal vias) in the area of the thermal pad as shown on the attached Land Pattern mechanical. These holes should be 13 mils in diameter. They are kept small so that solder wicking through the holes is not a problem during reflow. 3. It is recommended, but not required, to place a small number of the holes under the package and outside the thermal pad area. These holes provide additional heat path between the copper land and ground plane and are 25 mils in diameter. They may be larger because they are not in the area to be soldered, so wicking is not a problem. 4. Connect all holes, including those within the thermal pad area and outside the pad area, to the internal ground plane or other internal copper plane. 5. When connecting these holes to the ground plane, do not use the typical web or spoke via connection methodology; see Figure 7. Web connections have a high thermal resistance connection that is useful for slowing the heat transfer during soldering operations. This makes the soldering of vias that have plane connections easier. However, in this application, low thermal resistance is desired for the most efficient heat transfer. Therefore, the holes under the PowerPAD package should make their connection to the internal ground plane with a complete connection around the entire circumference of the plated through hole. Web or Spoke Via Solid Via NOT RECOMMENDED RECOMMENDED Figure 7. Via Connection Not Recommended for New Designs |
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