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TPS3780ADRYT Datasheet(PDF) 4 Page - Texas Instruments |
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TPS3780ADRYT Datasheet(HTML) 4 Page - Texas Instruments |
4 / 28 page TPS3779, TPS3780 SBVS250 – APRIL 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating junction temperature range (unless otherwise noted) (1) MIN MAX UNIT VDD –0.3 7 V OUT1, OUT2 (TPS3779 only) –0.3 VDD + 0.3 V Voltage OUT1, OUT2 (TPS3780 only) –0.3 7 V SENSE1, SENSE2 –0.3 7 V Current OUT1, OUT2 ±20 mA Operating junction, TJ –40 125 °C Temperature Storage, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 Electrostatic V(ESD) V discharge Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating junction temperature range (unless otherwise noted) MIN NOM MAX UNIT Power-supply voltage 1.5 6.5 V Sense voltage SENSE1, SENSE2 0 6.5 V Output voltage (TPS3779 only) OUT1, OUT2 0 VDD + 0.3 V Output voltage (TPS3780 only) OUT1, OUT2 0 6.5 V RPU Pullup resistor (TPS3780 only) 1.5 10,000 k Ω Current OUT1, OUT2 –5 5 mA CIN Input capacitor 0.1 µF TJ Junction temperature –40 25 125 °C 7.4 Thermal Information TPS3779, TPS3780 THERMAL METRIC(1) DRY (USON) DBV (SOT23-6) UNIT 6 PINS 6 PINS RθJA Junction-to-ambient thermal resistance 306.7 193.9 RθJC(top) Junction-to-case (top) thermal resistance 174.1 134.5 RθJB Junction-to-board thermal resistance 173.4 39.0 °C/W ψJT Junction-to-top characterization parameter 30.9 30.4 ψJB Junction-to-board characterization parameter 171.6 38.5 RθJC(bot) Junction-to-case (bottom) thermal resistance 65.2 N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, . 4 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: TPS3779 TPS3780 |
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