TPS3847

SBVS231A – AUGUST 2014 – REVISED MARCH 2015

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6 Specifications

6.1 Absolute Maximum Ratings

(1)

over operating junction temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCC

–0.3

+20

V

Voltage

MR

–0.3

VCC + 0.3

V

RESET

–0.3

+5.5

V

Current

RESET

10

mA

–40

+105

°C

–65

+150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.

(2)

As a result of the low dissipated power in this device, it is assumed that the junction temperature is equal to the ambient temperature.

6.2 ESD Ratings

VALUE

UNIT

±4000

Electrostatic discharge

V

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Power supply voltage

4.5

18

V

MR pin voltage

0

1.2

VCC

V

RESET pin voltage

0

5

V

RESET pin current

0

2

mA

Input capacitor

0

0.1

µF

Junction temperature

–40

+25

+85

°C

6.4 Thermal Information

TPS3847

DBV (SOT)

UNIT

5 PINS

Junction-to-ambient thermal resistance

208.5

Junction-to-case (top) thermal resistance

123.3

Junction-to-board thermal resistance

37.2

°C/W

Junction-to-top characterization parameter

14.6

Junction-to-board characterization parameter

36.3

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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