TPS3831, TPS3839

SBVS193D – JUNE 2012 – REVISED JULY 2015

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range, unless otherwise noted

(1)

MIN

MAX

UNIT

VDD, RESET

–0.3

7

V

Voltage

MR

–0.3

V

Current

RESET pin

–10

10

mA

–40

85

°C

–65

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

As a result of the low dissipated power in this device, the junction temperature is assumed to be equal to the ambient temperature.

7.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input supply voltage

0.9

6.5

V

Manual reset pin voltage

0

V

RESET pin voltage

0

6.5

V

RESET pin current

0

8

mA

7.4 Thermal Information

TPS3831,

TPS3839

TPS3839

UNIT

DBZ (SOT23-3)

DQN (X2SON)

3 PINS

4 PINS

Junction-to-ambient thermal resistance

346.6

216.1

°C/W

Junction-to-case (top) thermal resistance

124.4

161.7

°C/W

Junction-to-board thermal resistance

78.9

162.1

°C/W

Junction-to-top characterization parameter

11.5

5.1

°C/W

Junction-to-board characterization parameter

77.3

161.7

°C/W

Junction-to-case (bottom) thermal resistance

N/A

123.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6

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