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SN74LVC1G19DCKR Datasheet(PDF) 1 Page - Texas Instruments |
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SN74LVC1G19DCKR Datasheet(HTML) 1 Page - Texas Instruments |
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1 / 11 page  SN74LVC1G19 1OF2 DECODER/DEMULTIPLEXER SCES464B − JUNE 2003 − REVISED SEPTEMBER 2003 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Available in the Texas Instruments NanoStar and NanoFree Packages D Supports 5-V VCC Operation D Inputs Accept Voltages to 5.5 V D Max tpd of 4 ns at 3.3 V D Low Power Consumption, 10-µA Max ICC D ±24-mA Output Drive at 3.3 V D Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C D Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C D Ioff Supports Partial-Power-Down Mode Operation D Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II D ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) − 1000-V Charged-Device Model (C101) description/ordering information This decoder/demultiplexer is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC1G19 is a 1-of-2 decoder/demultiplexer. This device buffers the data on input A and passes it to the outputs Y0 (true) and Y1 (complement) when the enable (E) input signal is low. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION TA PACKAGE† ORDERABLE PART NUMBER TOP-SIDE MARKING‡ NanoStar − WCSP (DSBGA) 0.23-mm Large Bump − YEP Reel of 3000 SN74LVC1G19YEPR _ _ _CY_ −40 C to 85 C NanoFree − WCSP (DSBGA) 0.23-mm Large Bump − YZP (Pb-free) Reel of 3000 SN74LVC1G19YZPR _ _ _CY_ −40 °C to 85°C SOT (SOT-23) − DBV Reel of 3000 SN74LVC1G19DBVR C19_ SOT (SOT-23) − DBV Reel of 250 SN74LVC1G19DBVT C19_ SOT (SC-70) − DCK Reel of 3000 SN74LVC1G19DCKR CY_ SOT (SC-70) − DCK Reel of 250 SN74LVC1G19DCKT CY_ † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. ‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Copyright 2003, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar and NanoFree are trademarks of Texas Instruments. DBV OR DCK PACKAGE (TOP VIEW) 1 2 3 6 5 4 A GND E Y0 VCC Y1 3 2 1 4 5 6 E GND A Y1 VCC Y0 YEP OR YZP PACKAGE (BOTTOM VIEW) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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