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TPS54073 Datasheet(PDF) 2 Page - Texas Instruments |
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TPS54073 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 25 page ORDERING INFORMATION ABSOLUTE MAXIMUM RATINGS RECOMMENDED OPERATING CONDITIONS DISSIPATION RATINGS (1) (2) TPS54073 SLVS547 – FEBRUARY 2005 ............................................................................................................................................................................................ www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. TA OUTPUT VOLTAGE PACKAGE PART NUMBER –40°C to 85°C Adjustible down to 0.9 V Plastic HTSSOP (PWP)(1) TPS54073PWP (1) The PWP package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS54073PWPR). See the application section of the data sheet for PowerPAD drawing and layout information. over operating free-air temperature range (unless otherwise noted) (1) TPS54073 UNIT SS/ENA, SYNC –0.3 to 7 RT –0.3 to 6 VI Input voltage range VSENSE –0.3 to 4 V PVIN, VIN –0.3 to 4.5 BOOT –0.3 to 10 VBIAS, COMP, PWRGD –0.3 to 7 VO Output voltage range V PH –0.6 to 6 PH Internally limited VO Source current COMP, VBIAS 6 mA PH 25 A IS Sink current COMP 6 mA SS/ENA, PWRGD 10 Voltage differential AGND to PGND ±0.3 V TJ Operating junction temperature range –40 to 125 °C Tstg Storage temperature range –65 to 150 °C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300 °C (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. MIN NOM MAX UNIT VI Input voltage, VIN 3 4 V Power Input voltage, PVIN 2.2 4 V TJ Operating junction temperature –40 125 C THERMAL IMPEDANCE TA = 25°C TA = 70°C TA = 85°C PACKAGE JUNCTION-TO-AMBIENT POWER RATING POWER RATING POWER RATING 28-Pin PWP with solder 14.87°C/W 6.72 W(3) 3.69 W 2.69 W 28-Pin PWP without solder(4) 27.9°C/W 3.58 W 1.97 W 1.43 W (1) For more information on the PWP package, see TI technical brief, literature number SLMA002. (2) Test board conditions: a. 3 inch × 3 inch, 4 layers, thickness = 0.062 inch b. 2-ounce copper traces located on die top of the PCB. c. 2-ounce copper mixed plane and traces on the bottom of the PCB. d. 2-ounce copper ground planes on the two internal layers of the PCB. e. 12 thermal vias (see the Figure 11 in the Application Section of this data sheet. (3) Maximum power dissipation may be limited by over current protection. (4) Estimated performance 2 Submit Documentation Feedback Copyright © 2005, Texas Instruments Incorporated Product Folder Link(s): TPS54073 |
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