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TPS54073 Datasheet(PDF) 2 Page - Texas Instruments

Part # TPS54073
Description  2.2 ??4 -V, 14-A SYNCHRONOUS BUCK CONVERTER WITH DISABLED SINKING DURING START-UP
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TPS54073 Datasheet(HTML) 2 Page - Texas Instruments

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ORDERING INFORMATION
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
DISSIPATION RATINGS
(1) (2)
TPS54073
SLVS547 – FEBRUARY 2005 ............................................................................................................................................................................................ www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
TA
OUTPUT VOLTAGE
PACKAGE
PART NUMBER
–40°C to 85°C
Adjustible down to 0.9 V
Plastic HTSSOP (PWP)(1)
TPS54073PWP
(1)
The PWP package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS54073PWPR). See the application
section of the data sheet for PowerPAD drawing and layout information.
over operating free-air temperature range (unless otherwise noted)
(1)
TPS54073
UNIT
SS/ENA, SYNC
–0.3 to 7
RT
–0.3 to 6
VI
Input voltage range
VSENSE
–0.3 to 4
V
PVIN, VIN
–0.3 to 4.5
BOOT
–0.3 to 10
VBIAS, COMP, PWRGD
–0.3 to 7
VO
Output voltage range
V
PH
–0.6 to 6
PH
Internally limited
VO
Source current
COMP, VBIAS
6
mA
PH
25
A
IS
Sink current
COMP
6
mA
SS/ENA, PWRGD
10
Voltage differential
AGND to PGND
±0.3
V
TJ
Operating junction temperature range
–40 to 125
°C
Tstg
Storage temperature range
–65 to 150
°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
300
°C
(1)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
MIN
NOM
MAX
UNIT
VI
Input voltage, VIN
3
4
V
Power Input voltage, PVIN
2.2
4
V
TJ
Operating junction temperature
–40
125
C
THERMAL IMPEDANCE
TA = 25°C
TA = 70°C
TA = 85°C
PACKAGE
JUNCTION-TO-AMBIENT
POWER RATING
POWER RATING
POWER RATING
28-Pin PWP with solder
14.87°C/W
6.72 W(3)
3.69 W
2.69 W
28-Pin PWP without solder(4)
27.9°C/W
3.58 W
1.97 W
1.43 W
(1)
For more information on the PWP package, see TI technical brief, literature number SLMA002.
(2)
Test board conditions:
a. 3 inch × 3 inch, 4 layers, thickness = 0.062 inch
b. 2-ounce copper traces located on die top of the PCB.
c. 2-ounce copper mixed plane and traces on the bottom of the PCB.
d. 2-ounce copper ground planes on the two internal layers of the PCB.
e. 12 thermal vias (see the Figure 11 in the Application Section of this data sheet.
(3)
Maximum power dissipation may be limited by over current protection.
(4)
Estimated performance
2
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Copyright © 2005, Texas Instruments Incorporated
Product Folder Link(s): TPS54073


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