TPS54310

SLVS412E – DECEMBER 2001 – REVISED DECEMBER 2014

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN, SS/ENA, SYNC

–0.3

7

V

RT

–0.3

6

V

Input voltage

VSENSE

–0.3

4

V

BOOT

–0.3

17

V

VBIAS, PWRGD, COMP

–0.3

7

V

Output voltage

PH

–0.6

10

V

PH

Internally Limited

Output voltage

COMP, VBIAS

6

mA

PH

6

A

Sink current

COMP

6

mA

SS/ENA, PWRGD

10

mA

Voltage differential

AGND to PGND

–0.3

0.3

V

Continuous power dissipation

See Dissipation

Ratings

Operating virtual junction temperature

–40

150

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN

MAX

UNIT

Input voltage range

3

6

V

Operating junction temperature

–40

125

°C

7.4 Thermal Information

(1)

TPS54310

PWP

UNIT

20 PINS

Junction-to-ambient thermal resistance

26

°C/W

Junction-to-ambient thermal resistance (without solder coverage on PowerPad)

57.5

(1)

Test board conditions:

(a) 3 inch × 3 inch, 2 layers, Thickness: 0.062 inch

(b) 1.5 oz copper traces located on the top of the PCB

(c) 1.5 oz copper ground plane on the bottom of the PCB

(d) Ten thermal vias (see recommended land pattern in application section of this data sheet)

(2)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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