TPS54350

SLVS456C − OCTOBER 2003 − REVISED OCTOBER 2004

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2

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during

storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

TA

OUTPUT VOLTAGE

PACKAGE

PART NUMBER

−40

°C to 85°C

Adjustable to 0.891 V

Plastic HTSSOP (PWP)

TPS54350PWP

(1) The PWP package is also available taped and reeled. Add an R suffix to the device type (i.e. TPS54350PWPR).

PACKAGE

THERMAL IMPEDANCE

JUNCTION-TO-AMBIENT

TA = 25°C

POWER RATING

TA = 70°C

POWER RATING

TA = 85°C

POWER RATING

16-Pin PWP with solder(2)

42.1

°C/W

2.36

1.31

0.95

16-Pin PWP without solder

151.9

°C/W

0.66

0.36

0.26

(1) See Figure 46 for power dissipation curves.

(2) Test Board Conditions

1. Thickness: 0.062”

2. 3” x 3”

3. 2 oz. Copper traces located on the top and bottom of the PCB for soldering

4. Copper areas located on the top and bottom of the PCB for soldering

5. Power and Ground planes, 1 oz. Copper (0.036 mm thick)

6. Thermal vias, 0.33 mm diameter, 1.5 mm pitch

7. Thermal isolation of power plane

For more information, refer to TI technical brief SLMA002.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted(1)

UNIT

VIN

−0.3 V to 21.5 V

VSENSE

−0.3 V to 8.0 V

Input voltage range, VI

UVLO

−0.3 V to 8.0 V

Input voltage range, VI

SYNC

−0.3 V to 4.0 V

ENA

−0.3 V to 4.0 V

BOOT

VI(PH) + 8.0 V

VBIAS

−0.3 to 8.5 V

LSG

−0.3 to 8.5 V

SYNC

−0.3 to 4.0 V

Output voltage range, VO

RT

−0.3 to 4.0 V

Output voltage range, VO

PWRGD

−0.3 to 6.0 V

COMP

−0.3 to 4.0 V

PH

−1.5 V to 22 V

PH

Internally Limited (A)

Source current, IO

LSG (Steady State Current)

10 mA

Source current, IO

COMP, VBIAS

3 mA

SYNC

5 mA

LSG (Steady State Current)

100 mA

Sink current, IS

PH (Steady State Current)

500 mA

Sink current, IS

COMP

3 mA

ENA, PWRGD

10 mA

Voltage differential

AGND to PGND

±0.3 V

Operating virtual junction temperature range, TJ

−40

°C to +150°C

Storage temperature, Tstg

−65

°C to +150°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260

°C

(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.