TPS54495

SLVSBH0A – JUNE 2012 – REVISED MAY 2013

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING PART NUMBER

PINS

OUTPUT SUPPLY

TPS54495PWPR

Tape-and-Reel

PWP

16

TPS54495PWP

Tube

–40

℃ to 85℃

TPS54495RSAR

RSA

16

Tape-and-Reel

TPS54495RSAT

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(3)

All packaging options have Cu NIPDAU lead/ball finish.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1) (2)

VALUE

UNIT

VIN1, VIN2, EN1, EN2

–0.3 to 20

VBST1, VBST2

–0.3 to 26

VBST1, VBST2 (10ns transient)

–0.3 to 28

Input voltage range

VBST1–SW1 , VBST2–SW2

–0.3 to 6.5

V

VFB1, VFB2

–0.3 to 6.5

SW1, SW2

–2 to 20

SW1, SW2 (10ns transient)

–3 to 22

VREG5, SS1, SS2

–0.3 to 6.5

Output voltage range

V

PGND1, PGND2

–0.3 to 0.3

Human Body Model (HBM)

2

kV

Electrostatic discharge

Charged Device Model (CDM)

500

V

Operating ambient temperature range

–40 to 85

°C

Storage temperature range

–55 to 150

°C

Junction temperature range

–40 to 150

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" are not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to IC GND terminal.

THERMAL INFORMATION

TPS54495

UNITS

PWP (16) PINS

RSA (16) PINS

Junction-to-ambient thermal resistance

41.4

32.8

Junction-to-case (top) thermal resistance

27.8

35.4

Junction-to-board thermal resistance

23.2

9.9

°C/W

Junction-to-top characterization parameter

0.9

0.4

Junction-to-board characterization parameter

23.0

10.0

Junction-to-case (bottom) thermal resistance

3.5

1.6

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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