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TPS62151RGTT Datasheet(PDF) 5 Page - Texas Instruments |
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TPS62151RGTT Datasheet(HTML) 5 Page - Texas Instruments |
5 / 43 page 5 TPS62150, TPS62150A, TPS62151, TPS62152, TPS62153 www.ti.com SLVSAL5D – NOVEMBER 2011 – REVISED SEPTEMBER 2016 Product Folder Links: TPS62150 TPS62150A TPS62151 TPS62152 TPS62153 Submit Documentation Feedback Copyright © 2011–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network ground terminal. 7 Specifications 7.1 Absolute Maximum Ratings (1) over operating junction temperature range (unless otherwise noted) MIN MAX UNIT Pin voltage(2) AVIN, PVIN –0.3 20 V EN, SS/TR –0.3 VIN + 0.3 SW –0.3 VIN + 0.3 DEF, FSW, FB, PG, VOS –0.3 7 Power-good sink current PG 10 mA Temperature Operating junction temperature, TJ –40 150 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500 V 7.3 Recommended Operating Conditions over operating junction temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply Voltage, VIN (at AVIN and PVIN) 3 17 V Operating junction temperature, TJ –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information THERMAL METRIC(1) TPS6215x UNIT RGT 16 PINS RθJA Junction-to-ambient thermal resistance 45 °C/W RθJC(top) Junction-to-case(top) thermal resistance 53.6 °C/W RθJB Junction-to-board thermal resistance 17.4 °C/W ψJT Junction-to-top characterization parameter 1.1 °C/W ψJB Junction-to-board characterization parameter 17.4 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance 4.5 °C/W |
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