TPS62180, TPS62182

SLVSBB8A – AUGUST 2014 – REVISED AUGUST 2014

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8 Specifications

8.1 Absolute Maximum Ratings

(1)

Over operating junction temperature range (unless otherwise noted)

MIN

MAX

UNIT

VIN1, VIN2

–0.3

17

V

EN, PG, SW1, SW2

–0.3

V

SS/TR

–0.3

V

≤ 7

FB, VO

–0.3

7

V

Power good sink

PG

10

mA

current

Operating junction

–40

150

°C

temperature range

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to network ground pin.

8.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

–65

150

°C

–1

1

(1)

kV

Charge device model (CDM) ESD stress voltage

–0.5

0.5

(1)

Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in

to the device.

(2)

Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows

safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

Over operating junction temperature range (unless otherwise noted)

MIN

TYP

MAX

UNIT

4

15

V

0.9

6

V

0.9V

6

Maximum Output current,

A

6

–40

125

°C

8.4 Thermal Information

TPS6218x

UNIT

YZF (24 PINS)

Junction-to-ambient thermal resistance

61.5

Junction-to-case (top) thermal resistance

0.3

R

Junction-to-board thermal resistance

10.1

°C/W

Junction-to-top characterization parameter

0.1

Junction-to-board characterization parameter

10.1

Junction-to-case (bottom) thermal resistance

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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