TPS62620, TPS62621, TPS62622

TPS62623, TPS62624, TPS62625

SLVS848D – JULY 2009 – REVISED OCTOBER 2015

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Table of Contents

1

Features .................................................................. 1

9

Application and Implementation ........................ 10

9.1

Application Information............................................ 10

2

Applications ........................................................... 1

9.2

Typical Application ................................................. 10

3

Description ............................................................. 1

10

Power Supply Recommendations ..................... 19

4

Revision History..................................................... 2

11

Layout................................................................... 19

5

Device Comparison Table..................................... 3

11.1

Layout Guidelines ................................................. 19

6

Pin Configuration and Functions ......................... 3

11.2

Layout Example .................................................... 19

7

Specifications......................................................... 4

11.3

Thermal Information .............................................. 20

7.1

Absolute Maximum Ratings ...................................... 4

12

Device and Documentation Support ................. 20

7.2

ESD Ratings.............................................................. 4

12.1

Related Links ........................................................ 20

7.3

Recommended Operating Conditions ....................... 4

12.2

Community Resources.......................................... 20

7.4

Thermal Information .................................................. 4

12.3

Trademarks ........................................................... 20

7.5

Electrical Characteristics........................................... 5

12.4

Electrostatic Discharge Caution ............................ 20

7.6

Typical Characteristics .............................................. 6

12.5

Glossary ................................................................ 21

8

Detailed Description .............................................. 7

13

Mechanical, Packaging, and Orderable

8.1

Overview ................................................................... 7

Information ........................................................... 21

8.2

Functional Block Diagram ......................................... 7

13.1

Package Summary................................................ 21

8.3

Feature Description................................................... 8

13.2

Chip Scale Package Dimensions.......................... 21

8.4

Device Functional Modes.......................................... 8

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (August 2011) to Revision D

Page

•

Added ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes,

Application and Implementation section, Power Supply Recommendations section, Layout section, Device and

Documentation Support section, and Mechanical, Packaging, and Orderable Information section....................................... 1

•

Changed Chip Scale package marking code from YMSS and LLLL, to YMDS and CC...................................................... 21

Changes from Revision B (December 2009) to Revision C

Page

•

Changes from Revision A (July 2009) to Revision B

Page

•

Added YFD package option ................................................................................................................................................. 21

2

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