TPS63050, TPS63051

SLVSAM8C – JULY 2013 – REVISED JULY 2015

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7 Specifications

7.1 Absolute Maximum Ratings

over junction temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

7

–0.3

7

V

–0.3

9.5

–40

150

°C

–40

85

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground pin.

(3)

DC voltage rating.

(4)

AC voltage rating.

7.2 ESD Ratings

VALUE

UNIT

±1500

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±700

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN

NOM MAX

UNIT

Input voltage

2.5

5.5

V

Output current

0.5

A

L

1

1.5

2.2

µH

10

µF

Operating ambient temperature

–40

85

°C

Operating virtual junction temperature

–40

125

°C

(1)

Refer to the Application Information section for further information

(2)

Effective inductance value at operating condition. The nominal value given matches a typical inductor to be chosen to meet the

inductance required.

(3)

Due to the DC bias effect of ceramic capacitors, the effective capacitance is lower then the nominal value when a voltage is applied.

This is why the capacitance is specified to allow the selection of the nominal capacitor required with the DC bias effect for this type of

capacitor. The nominal value given matches a typical capacitor to be chosen to meet the minimum capacitance required.

7.4 Thermal Information

TPS6305x

WCSP

RMW

UNIT

12 PINS

12 PINS

Junction-to-ambient thermal resistance

89.9

37.3

°C/W

Junction-to-case (top) thermal resistance

0.7

30.4

°C/W

Junction-to-board thermal resistance

43.9

8.0

°C/W

Junction-to-top characterization parameter

2.9

0.4

°C/W

Junction-to-board characterization parameter

43.7

7.8

°C/W

Junction-to-case (bottom) thermal resistance

n/a

2.5

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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