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TPS61254YFFR Datasheet(PDF) 6 Page - Texas Instruments |
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TPS61254YFFR Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 37 page  6 TPS61253, TPS61254, TPS61256, TPS61258, TPS61259, TPS612592 SLVSAG8G – SEPTEMBER 2011 – REVISED JUNE 2016 www.ti.com Product Folder Links: TPS61253 TPS61254 TPS61256 TPS61258 TPS61259 TPS612592 Submit Documentation Feedback Copyright © 2011–2016, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information THERMAL METRIC(1) TPS6125x UNIT YFF 9 PINS RθJA Junction-to-ambient thermal resistance 108.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 1.0 RθJB Junction-to-board thermal resistance 18 ψJT Junction-to-top characterization parameter 4.2 ψJB Junction-to-board characterization parameter 17.9 7.5 Electrical Characteristics Minimum and maximum values are at VIN = 2.3V to 5.5V, EN = 1.8V, TA = –40°C to 85°C; Circuit of Parameter Measurement Information section (unless otherwise noted). Typical values are at VIN = 3.6V, EN = 1.8V, TA = 25°C (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SUPPLY CURRENT IQ Operating quiescent current into VIN Operating quiescent current into VOUT Standby mode quiescent current into VIN Standby mode quiescent current into VOUT IOUT = 0mA, VIN = 3.6V EN = VIN, BP = GND Device not switching 30 45 µA 7 15 µA IOUT = 0mA, VIN = VOUT = 3.6V EN = GND, BP = VIN Device not switching 11 20 µA 9.5 15 µA ISD Shutdown current EN = GND, BP = GND 0.85 5.0 μA VUVLO Under-voltage lockout threshold Falling 2.0 2.1 V Hysteresis 0.1 V ENABLE, BYPASS VIL Low-level input voltage 0.4 V VIH High-level input voltage 1.0 V Ilkg Input leakage current Input connected to GND or VIN 0.5 µA |
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