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TPS62134A Datasheet(PDF) 4 Page - Texas Instruments

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Part # TPS62134A
Description  TPS62134x, 17-V Input, Step-down Converter With Low-Power Mode Input for Intel Skylake Platform
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TPS62134A Datasheet(HTML) 4 Page - Texas Instruments

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TPS62134A, TPS62134B, TPS62134C, TPS62134D
SLVSC20D – JANUARY 2015 – REVISED MAY 2015
www.ti.com
8 Specifications
8.1 Absolute Maximum Ratings
(1)
over operating junction temperature range (unless otherwise noted)
MIN
MAX
UNIT
AVIN, PVIN
–0.3
20
EN, SW
–0.3
VI + 0.3
Voltage at pins(2)
V
SS, PG, VOS, VID0, VID1, LPM
–0.3
7
FBS
–0.3
3
Sink current
PG
0
2
mA
Operating junction temperature, TJ
–40
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground pin.
8.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS–001 (1)
±2000
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC specification JESD22-
±500
C101(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
8.3 Recommend Operating Conditions
over operating junction temperature range, unless otherwise noted.
MIN
MAX
UNIT
VI
Input voltage (AVIN, PVIN)
3
17
V
V(PG)
PG pin pullup resistor voltage
0
6
V
3 V
≤ VI < 5 V
0
3
IO
Output current
A
5 V
≤ VI ≤ 17 V
0
3.2
TJ
Operating junction temperature
–40
125
°C
8.4 Thermal Information
TPS62134x
THERMAL METRIC(1)
UNIT
RGT Package
RθJA
Junction-to-ambient thermal resistance
44.2
RθJC(top)
Junction-to-case (top) thermal resistance
51.0
RθJB
Junction-to-board thermal resistance
16.6
°C/W
ψJT
Junction-to-top characterization parameter
0.9
ψJB
Junction-to-board characterization parameter
16.6
RθJC(bot)
Junction-to-case (bottom) thermal resistance
3.7
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953
4
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Copyright © 2015, Texas Instruments Incorporated
Product Folder Links: TPS62134A TPS62134B TPS62134C TPS62134D


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