FBS

8

7

6

5

13

14

15

16

1

2

3

4

12

11

10

9

Exposed

Thermal PAD

AGND

SS

VID1

PGND

PGND

LPM

EN

TPS62134A, TPS62134B, TPS62134C, TPS62134D

www.ti.com

SLVSC20D – JANUARY 2015 – REVISED MAY 2015

6 Device Comparison Table

PART NUMBER

PACKAGE MARKING

OUTPUT VOLTAGE

TPS62134A

134A

TPS62134B

134B

See Table 1

TPS62134C

134C

TPS62134D

134D

7 Pin Configuration and Functions

RGT Package

16-Pin VQFN With Thermal Pad

Top View

Pin Functions

PIN

TYPE

DESCRIPTION

NO.

NAME

Output voltage sense pin and connection for the control loop circuitry. The VOS pin must be connected

1

VOS

I

directly at the output capacitor.

2

This pin is a switch node and is connected to the internal MOSFET switches. Connect an inductor

SW

PWR

between the SW pin and output capacitor.

3

Output power-good pin. The PG pin is an open drain and requires a pullup resistor. If this pin is not in use,

4

PG

O

leave it floating.

Output-voltage feedback pin. This pin is used for a positive remote sense of the load voltage. The FBS pin

5

FBS

I

must be connected close to the load-supply node on the output bus.

Analog ground pin. The AGND pin must be connected directly to the exposed thermal pad and common

6

AGND

—

ground plane.

7

SS

O

Soft-start pin. An external capacitor connected to this pin sets the soft-start time.

8

VID1

I

Output-voltage selection pins (VIDx).

9

VID0

Supply-voltage pin for the internal control circuitry. Connect the AVIN pin to the same source as the PVIN

10

AVIN

I

pin.

11

PVIN

PWR

Supply-voltage pins for the internal power stage.

12

13

EN

I

Enable and disable input pin. An internal pulldown resistor maintains logic-level low if the pin is floating.

14

LPM

I

Low-power-mode input pin.

15

Power ground. The PGND pin must be connected directly to the exposed thermal pad and common

PGND

—

ground plane.

16

—

Exposed

The exposed thermal pad must be connected to the AGND (6) pin, PGND (15 and 16) pins, and common

Thermal

—

ground plane. The thermal pad must be soldered to achieve appropriate power dissipation and

Pad

mechanical reliability.

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