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NCP717CMX330TCG Datasheet(PDF) 2 Page - ON Semiconductor |
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NCP717CMX330TCG Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 16 page NCP717 www.onsemi.com 2 IN OUT BANDGAP REFERENCE ACTIVE DISCHARGE* MOSFET DRIVER WITH CURRENT LIMIT THERMAL SHUTDOWN ENABLE LOGIC GND AUTO LOW POWER MODE EN EN Figure 2. Simplified Schematic Block Diagram *Active output discharge function is present only in NCP717AMXyyyTCG and NCP717CMXyyyTCG devices. yyy denotes the particular VOUT option. PIN FUNCTION DESCRIPTION Pin No. Pin Name Description 1 OUT Regulated output voltage pin. A small ceramic capacitor with minimum value of 1 mF is needed from this pin to ground to assure stability. 2 GND Power supply ground. 3 EN Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into shutdown mode. 4 IN Input pin. A small capacitor is needed from this pin to ground to assure stability. − EPAD Exposed pad should be connected directly to the GND pin. Soldered to a large ground copper plane allows for effective heat removal. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (Note 1) VIN −0.3 V to 6 V V Output Voltage VOUT −0.3 V to VIN + 0.3 V V Enable Input VEN −0.3 V to VIN + 0.3 V V Output Short Circuit Duration tSC ∞ s Maximum Junction Temperature TJ(MAX) 150 °C Storage Temperature TSTG −55 to 150 °C ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V ESD Capability, Machine Model (Note 2) ESDMM 200 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per EIA/JESD22−A114, ESD Machine Model tested per EIA/JESD22−A115, Latchup Current Maximum Rating tested per JEDEC standard: JESD78. THERMAL CHARACTERISTICS Rating Symbol Value Unit Thermal Characteristics, XDFN4 1x1 mm Thermal Resistance, Junction−to−Air RqJA 250 °C/W |
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