Electronic Components Datasheet Search |
|
NCP786LSTADJT3G Datasheet(PDF) 5 Page - ON Semiconductor |
|
NCP786LSTADJT3G Datasheet(HTML) 5 Page - ON Semiconductor |
5 / 7 page NCP786L www.onsemi.com 5 APPLICATION INFORMATION The typical application circuit for the NCP786L device is shown below. Figure 7. Typical Application Schematic NCP786L Cin Cout R1 R2 2.2 uF Vout = 1.27 V – 15 V / 5 mA IN GND OUT ADJ Vin = (55 – 450) Vdc NCP786L Cin Cout R1 R2 2.2 uF Vout = 1.27 V – 15 V / 5 mA IN GND OUT ADJ Vin = (40 – 320) Vac NCP786L Cin Cout R1 R2 2.2 uF Vout = 1.27 V – 15 V / 5 mA IN GND OUT ADJ Vin = (40 – 320) Vac Input Decoupling (C1) A 1.0 mF capacitor either ceramic or electrolytic is recommended and should be connected close to the input pin of NCP786L. Higher value 2.2 mF is necessary to keep the input voltage above the required minimum input voltage at full load for AC voltage as low as 85 V with half wave rectifier. The capacitor 1 mF could be acceptable for DC input voltage from 55 V up to 450 V or AC input voltage 235 V ±20%. There must be assured minimum Input Voltage more than 55 V at input pin of NCP786L regulator in order to keep stable desired output voltage with guaranteed parameters at AC supply. Output Decoupling (C2) The NCP786L Regulator does not require any specific Equivalent Series Resistance (ESR). Thus capacitors exhibiting ESRs ranging from a few m W up to 0.5 W can be used safely. The minimum decoupling value is 2.2 mF. The regulator accepts ceramic chip capacitors as well as tantalum devices or low ESR electrolytic capacitors. Larger values improve noise rejection and especially load transient response. Layout Recommendations Please be sure that the VIN and GND lines are sufficiently wide. When the impedance of these lines is high, there is a chance to pick up a noise or to cause the malfunction of regulator by induced parasitic signal. Set external components, especially the output capacitor, as close as possible to the circuit, and make leads as short as possible. Thermal As power across the NCP786L increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design layout and used package. Mounting pad configuration on the PCB, the board material, and also the ambient temperature affect the rate of temperature rise for the part. This is stating that when the NCP786L has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. |
Similar Part No. - NCP786LSTADJT3G |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |