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NCP563SQ18T1G Datasheet(PDF) 5 Page - ON Semiconductor |
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NCP563SQ18T1G Datasheet(HTML) 5 Page - ON Semiconductor |
5 / 8 page NCP562, NCV562, NCP563, NCV563 www.onsemi.com 5 −400 0 Figure 9. Line Transient Response Figure 10. Load Transient Response 3.5 1000 1 0.1 0.01 f, FREQUENCY (kHz) 0.5 VIN = 5.0 V VOUT = 3.0 V IOUT = 50 mA COUT = 0.1 mF 1.5 1 2 2.5 10 100 −1 6 500 250 200 100 50 0 t, TIME ( ms) −0.5 1 0 4 3 150 300 350 VOUT = 3.0 V COUT = 0.1 mF IOUT = 10 mA 400 450 0.5 5 60 500 250 200 100 50 0 t, TIME ( ms) −1 0.5 −0.5 0 −30 150 300 350 400 450 0 30 1 3 IOUT = 1 mA to 30 mA VIN = 4.0 V VOUT = 3.0 V COUT = 0.1 mF 60 600 200 100 500 0 t, TIME ( ms) −30 0 0 400 300 700 400 800 −200 30 200 IOUT = 1 mA to 30 mA VIN = 4.0 V COUT = 1.0 mF VOUT = 3.0 V 900 1000 Figure 11. Load Transient Response Figure 12. Output Voltage Noise DEFINITIONS Load Regulation The change in output voltage for a change in output current at a constant temperature. Dropout Voltage The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 3.0% below its nominal. The junction temperature, load current, and minimum input supply requirements affect the dropout level. Maximum Power Dissipation The maximum total dissipation for which the regulator will operate within its specifications. Quiescent Current The quiescent current is the current which flows through the ground when the LDO operates without a load on its output: internal IC operation, bias, etc. When the LDO becomes loaded, this term is called the Ground current. It is actually the difference between the input current (measured through the LDO input pin) and the output current. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse technique such that the average chip temperature is not significantly affected. Line Transient Response Typical over and undershoot response when input voltage is excited with a given slope. Thermal Protection Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 160 °C, the regulator turns off. This feature is provided to prevent failures from accidental overheating. Maximum Package Power Dissipation The maximum power package dissipation is the power dissipation level at which the junction temperature reaches its maximum operating value, i.e. 125 °C. Depending on the ambient power dissipation and thus the maximum available output current. |
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