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NCP563SQ25T1G Datasheet(PDF) 6 Page - ON Semiconductor |
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NCP563SQ25T1G Datasheet(HTML) 6 Page - ON Semiconductor |
6 / 8 page NCP562, NCV562, NCP563, NCV563 www.onsemi.com 6 APPLICATIONS INFORMATION A typical application circuit for the NCP562 and NCP563 series are shown in Figure 1 and Figure 2. Input Decoupling (C1) A 1.0 mF capacitor either ceramic or tantalum is recommended and should be connected close to the NCP562 package. Higher values and lower ESR will improve the overall line transient response. TDK capacitor: C2012X5R1C105K, or C1608X5R1A105K Output Decoupling (C2) The NCP562 and NCP563 are very stable regulators and do not require any specific Equivalent Series Resistance (ESR) or a minimum output current. Capacitors exhibiting ESRs ranging from a few m W up to 10 W can thus safely be used. The minimum decoupling value is 0.1 mF and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum devices. Larger values improve noise rejection and load regulation transient response. TDK capacitor: C2012X5R1C105K, C1608X5R1A105K, or C3216X7R1C105K Enable Operation (NCP562 ONLY) The enable pin will turn on the regulator when pulled high and turn off the regulator when pulled low. These limits of threshold are covered in the electrical specification section of this data sheet. If the enable is not used, then the pin should be connected to Vin. Hints Please be sure the Vin and GND lines are sufficiently wide. When the impedance of these lines is high, there is a chance to pick up noise or cause the regulator to malfunction. Place external components, especially the output capacitor, as close as possible to the circuit, and make leads as short as possible. Thermal As power across the NCP562 and NCP563 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material and also the ambient temperature effect the rate of temperature rise for the part. This is stating that when the devices have good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. The maximum dissipation the package can handle is given by: PD + TJ(max) *TA R qJA If junction temperature is not allowed above the maximum 125 °C, then the NCP562 and NCP563 can dissipate up to 250 mW @ 25 °C. The power dissipated by the NCP562 and NCP563 can be calculated from the following equation: Ptot + Vin *Ignd (Iout) ) [Vin * Vout] *Iout or VinMAX + Ptot ) Vout * Iout Ignd ) Iout If an 80 mA output current is needed then the ground current from the data sheet is 2.5 mA. For an NCP562 or NCP563 (3.0 V), the maximum input voltage will then be 6.0 V. |
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