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All specifications may change without notice

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Version 3.0

Package Dimensions (Type: SP-1E)

* Unit: mm[inch] | Tolerance: ±0.15[.006]

* Unit: mm[inch] | Tolerance: ±0.15[.006]

Pin Description (RTH35003-20D)

Pin No

Function

Pin No

Function

Pin No

Function

Pin No

Function

1

Vgd

4

GND

8

GND

11

Vds

2

RF In

5

Vgp

9

RF Out

12

GND

3

GND

6

GND

10

GND

13

Vgc

7

Vds

14

Vds

Recommended Mounting Configuration

* Mounting Configuration Notes

1. For the proper performance of the device, Ground / Thermal via holes must be designed to remove heat.

2. To properly use heatsink, ensure the ground/thermal via hole region to contact the heatsink. We recommend the mounting screws

be added near the heatsink to mount the board

3. In designing the necessary RF trace, width will depend upon the PCB material and construction.

4. Use 1 oz. Copper minimum thickness for the heatsink.

5. Do not put solder mask on the backside of the PCB in the region where the board contacts the heatsink

6. We recommend adding as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.

7. We recommend that the PCB with the RF device in a hybrid package(RTH Series) is not washed to remove the flux.

20

[.787]

32

[1.26]

4.2

[.165]

LID

PCB

4

[.157]

7

[.276]

7

[.276]

7

[.276]

7

[.276]

5

[.197]

31.8

[1.252]

1

[.039]

3

[.118]

1.5

[.059]

2.5

[.098]