NCP785A

www.onsemi.com

10

PACKAGE DIMENSIONS

SOT−89, 3 LEAD

CASE 528AG

ISSUE O

MOUNTING FOOTPRINT*

RECOMMENDED

C

0.10

TOP VIEW

SIDE VIEW

BOTTOM VIEW

C

H

1

DIM

MIN

MAX

MILLIMETERS

A

1.40

1.60

b1

0.46

0.55

b

0.38

0.47

c

0.40

0.44

D

4.40

4.60

D2

1.60

1.90

E

2.40

2.60

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. LEAD THICKNESS INCLUDES LEAD FINISH.

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS, OR GATE BURRS.

5. DIMENSIONS L, L2, D2, AND H ARE MEASURED AT

DATUM PLANE C.

6. CENTER LEAD CONTOUR MAY VARY WITHIN THE

REGION DEFINED BY DIMENSION E.

7. DIMENSION D2 IS DEFINED AT ITS WIDEST POINT.

e

L

0.89

1.20

H

4.05

4.25

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

D

E

A

c

23

b

b1

L2

D2

L

0.58

DIMENSIONS: MILLIMETERS

1

2X

1.50

0.86

1.57

4.45

2X

0.50

2.00

12

3

A

B

e

e

1.50 BSC

PACKAGE

OUTLINE

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NCP785A/D

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