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NCP720BMT135TBG Datasheet(PDF) 2 Page - ON Semiconductor |
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NCP720BMT135TBG Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 9 page NCP720 www.onsemi.com 2 EN CURRENT LIMIT THERMAL LIMIT UVLO + − VOLTAGE REFERENCE IN BIAS GND OUT ENABLE BLOCK Figure 2. Simplified Schematic Block Diagram PIN FUNCTION DESCRIPTION Pin No. Pin Name Description 1 OUT Regulated Output Voltage pin 2 N/C Not internally connected 3 EN Enable pin. Driving this pin high enables the regulator. Driving this pin low puts the regulator into shutdown mode. 4 BIAS Bias voltage supply for internal control circuits. This pin is monitored by internal Under-Voltage Lockout Circuit. 5 GND Ground pin 6 IN Input Voltage Supply pin Pad Should be soldered to the ground plane for increased thermal performance. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (Note 1) VIN −0.3 to 6 V Output Voltage VOUT −0.3 to (VIN+0.3) ≤ 6 V Chip Enable and Bias Input VEN, VBIAS −0.3 to 6 V Output Short Circuit Duration tSC unlimited s Maximum Junction Temperature TJ 150 °C Storage Temperature TSTG −55 to 150 °C ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V ESD Capability, Machine Model (Note 2) ESDMM 200 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection (except OUT pin) and is tested by the following methods: ESD Human Body Model tested per EIA/JESD22−A114 ESD Machine Model tested per EIA/JESD22−A115 Latchup Current Maximum Rating tested per JEDEC standard: JESD78. THERMAL CHARACTERISTICS Rating Symbol Value Unit Thermal Characteristics, WDFN6 2 mm x 2 mm Thermal Resistance, Junction−to−Air (Note 3) RqJA 65 °C/W 3. This data was derived by thermal simulations based on the JEDEC JESD51 series standards methodology. Only a single device mounted at the center of a high *K (2s2p) 3in x 3in multilayer board with 1−ounce internal planes and 2−ounce copper on top and bottom. Top copper layer has a dedicated 125 sqmm copper area. |
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