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SN74LVC2G07DBVR Datasheet(PDF) 1 Page - Texas Instruments |
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SN74LVC2G07DBVR Datasheet(HTML) 1 Page - Texas Instruments |
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1 / 13 page  SN74LVC2G07 DUAL BUFFER/DRIVER WITH OPENDRAIN OUTPUTS SCES308E − AUGUST 2001 − REVISED SEPTEMBER 2003 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Available in the Texas Instruments NanoStar and NanoFree Packages D Supports 5-V VCC Operation D Inputs and Open-Drain Outputs Accept Voltages Up To 5.5 V D Max tpd of 3.7 ns at 3.3 V D Low Power Consumption, 10-µA Max ICC D ±24-mA Output Drive at 3.3 V D Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C D Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C D Ioff Supports Partial-Power-Down Mode Operation D Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II D ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) − 1000-V Charged-Device Model (C101) description/ordering information This dual buffer/driver is designed for 1.65-V to 5.5-V VCC operation. The output of the SN74LVC2G07 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA. ORDERING INFORMATION TA PACKAGE† ORDERABLE PART NUMBER TOP-SIDE MARKING‡ NanoStar − WCSP (DSBGA) 0.17-mm Small Bump − YEA SN74LVC2G07YEAR NanoFree − WCSP (DSBGA) 0.17-mm Small Bump − YZA (Pb-free) Reel of 3000 SN74LVC2G07YZAR _ _ _CV_ −40 °C to 85°C NanoStar − WCSP (DSBGA) 0.23-mm Large Bump − YEP Reel of 3000 SN74LVC2G07YEPR _ _ _CV_ −40 °C to 85°C NanoFree − WCSP (DSBGA) 0.23-mm Large Bump − YZP (Pb-free) SN74LVC2G07YZPR SOT (SOT-23) − DBV Reel of 3000 SN74LVC2G07DBVR C07_ SOT (SC-70) − DCK Reel of 3000 SN74LVC2G07DCKR CV_ SOT (SC-70) − DCK Reel of 250 SN74LVC2G07DCKT CV_ † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. ‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YEA/YZA,YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Copyright 2003, Texas Instruments Incorporated DBV OR DCK PACKAGE (TOP VIEW) 1 2 3 6 5 4 1A GND 2A 1Y VCC 2Y 3 2 1 4 5 6 2A GND 1A 2Y VCC 1Y YEA, YEP, YZA, OR YZP PACKAGE (BOTTOM VIEW) NanoStar and NanoFree are trademarks of Texas Instruments. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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