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AP3608E Datasheet(PDF) 5 Page - BCD Semiconductor Manufacturing Limited |
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AP3608E Datasheet(HTML) 5 Page - BCD Semiconductor Manufacturing Limited |
5 / 15 page EIGHT-CHANNEL CONSTANT CURRENT SINK WITH CURRENT MATCH AP3608E 5 Mar. 2011 Rev. 1. 5 BCD Semiconductor Manufacturing Limited Data Sheet Ordering Information Package Temperature Range Part Number Marking ID Packing Type QFN-4 ×4-24 -40 to 85oC AP3608EFNTR-G1 B3B Tape & Reel TSSOP-20(EDP) AP3608EGTR-G1 AP3608EG-G1 Tape & Reel SOIC-20 AP3608EM-G1 AP3608EM-G1 Tube AP3608EMTR-G1 AP3608EM-G1 Tape & Reel Circuit Type Package FN: QFN-4×4-24 G1: Green AP3608E - TR: Tape and Reel BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and green. Parameter Symbol Value Unit Input Voltage VCC -0.3 to 6 V ISET Pin Voltage VISET -0.3 to 6 V EN Pin Voltage VEN -0.3 to 6 V Feedback Pin Voltage VFB -0.3 to 6 V SDB Pin Voltage VSDB -0.3 to 6 V PWM Pin Voltage VPWM -0.3 to 6 V Voltage per Channel (Note 3) VCHX -0.3 to 40 V Thermal Resistance (Junction to Ambient, No Heat Sink) θJA QFN-4 ×4-24 60 oC/W TSSOP-20(EDP) 35 (Note 2) SOIC-20 87 Operating Junction Temperature TJ 150 oC Storage Temperature Range TSTG -65 to 150 oC Lead Temperature (Soldering, 10sec) TLEAD 260 oC ESD (Machine Model) 200 V ESD (Human Body Model) 6000 V Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods may affect device reliability. Note 2: The chip is soldered to 60mm2 (4mm ×15mm) copper (top side solder mask) of 1oz. on PCB with 8×0.5mm vias. Note 3: Breakdown voltage. Absolute Maximum Ratings (Note 1) G: TSSOP-20(EDP) Blank: Tube M: SOIC-20 |
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