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DA14581 Datasheet(PDF) 4 Page - Dialog Semiconductor |
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DA14581 Datasheet(HTML) 4 Page - Dialog Semiconductor |
4 / 152 page Datasheet Revision 3.0 18-Dec-2015 CFR0011-120-00-FM Rev 5 4 of 152 © 2015 Dialog Semiconductor DA14581 Low Power Bluetooth Smart SoC with optimized boot time FINAL 2 Pinout The DA14581 comes in two packages: • A Wafer Level Chip Scale Package (WLCSP) with 34 balls • A Quad Flat Package No Leads (QFN) with 40 pins The actual pin/ball assignment is depicted in the follow- ing figures: Figure 2: WLCSP ball assignment 1 2345 A B C D E 6 F DA14581 (Top View) Figure 3: QFN40 pin assignment 8 7 6 5 4 3 2 1 23 24 25 26 27 28 29 30 Pin 0: GND plane P0_0 P0_1 P0_2 P0_3 NC P0_4 P2_1 XTAL16Mm XTAL16Mp P1_3 P1_2 SW_CLK SWDIO P1_1 VBAT1V 10 9 P0_7 21 22 SWITCH P1_0 DA14581 (Top View) P0_5 P0_6 |
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